MediaTek Dimensity 8100

Pemproses ini dihasilkan menggunakan proses 5nm oleh TSMC, diumumkan pada Mac 2022. Ia mempunyai 8 teras, beroperasi pada frekuensi 2850MHz, mempunyai TDP sebanyak 6W, dan mengintegrasikan GPU Mali-G610 MP6.

CPU

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Seni bina

4x 2.85 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

Frekuensi

2850 MHz

Teras

8

Set arahan

ARMv8.2-A

Cache L3

0

Proses

5 nm

TDP

6 W

Pembuatan

TSMC

Grafik

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Nama GPU

Mali-G610 MP6

Frekuensi GPU

860 MHz

Unit pelaksanaan

6

FLOPS

1.309 TFLOPS

Versi Vulkan

1.3

Versi OpenCL

2.0

Versi DirectX

12

FLOPS

1309 GFLOPS

Memori

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Jenis memori

LPDDR5

Frekuensi memori

3200 MHz

Bas

4x 16 Bit

Lebar jalur maks

51.2 Gbit/s

Multimedia (ISP)

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Pemproses neural (NPU)

Yes

Jenis storan

UFS 3.1

Resolusi paparan maks

2960 x 1440

Resolusi kamera maks

1x 200MP

Rakaman video

4K at 60FPS

Main balik video

4K at 60FPS

Codec video

H.264, H.265, AV1, VP9

Codec audio

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Kesambungan

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Sokongan 4G

LTE Cat. 21

Sokongan 5G

Yes

Kelajuan muat turun

Up to 4700 Mbps

Kelajuan muat naik

Up to 2500 Mbps

Wi-Fi

6

Bluetooth

5.3

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

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Diumumkan

Mac 2022

Kelas

Flagship

Nombor model

MT6895Z/TCZA

Halaman rasmi

MediaTek Dimensity 8100

Peringkat

[Laporkan Masalah]

AnTuTu 10

HiSilicon Kirin 9000S 8C @ 2620 MHz

903932

MediaTek Dimensity 8200 8C @ 3100 MHz

903370

Qualcomm Snapdragon 7 Gen 3 8C @ 2630 MHz

866863

MediaTek Dimensity 8100 8C @ 2850 MHz

860129

Qualcomm Snapdragon 888 Plus 8C @ 2995 MHz

836957

Apple A13 Bionic 6C @ 2650 MHz

811843

Qualcomm Snapdragon 870 8C @ 3200 MHz

810488

Geekbench 6 Single Core

Samsung Exynos 1480 8C @ 2750 MHz

1168

Qualcomm Snapdragon 865 Plus 8C @ 3100 MHz

1163

Qualcomm Snapdragon 870 8C @ 3200 MHz

1151

MediaTek Dimensity 8100 8C @ 2850 MHz

1145

Qualcomm Snapdragon 7 Gen 3 8C @ 2630 MHz

1139

HiSilicon Kirin 9000E 5G C @

1137

MediaTek Dimensity 7200 Ultra 8C @ 2800 MHz

1134

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus 8C @ 2995 MHz

3778

MediaTek Dimensity 8020 8C @ 2600 MHz

3709

Samsung Exynos 2200 8C @ 2800 MHz

3685

MediaTek Dimensity 8100 8C @ 2850 MHz

3633

HiSilicon Kirin 9000 8C @ 3130 MHz

3529

Samsung Exynos 1480 8C @ 2750 MHz

3503

Google Tensor G2 8C @ 2850 MHz

3468

FP32 (float)

MediaTek Dimensity 8200 8C @ 3100 MHz

1442

Qualcomm Snapdragon 865 Plus 8C @ 3100 MHz

1372

Qualcomm Snapdragon 870 8C @ 3200 MHz

1372

MediaTek Dimensity 8000 8C @ 2750 MHz

1309

MediaTek Dimensity 8100 8C @ 2850 MHz

1309

Qualcomm Snapdragon 865 8C @ 2840 MHz

1202

Google Tensor G2 8C @ 2850 MHz

1142

Perbandingan Berkaitan

1

Qualcomm Snapdragon 7 Gen 3 vs MediaTek Dimensity 8100

2

Qualcomm Snapdragon 8s Gen 3 vs MediaTek Dimensity 8100

3

Samsung Exynos 1480 vs MediaTek Dimensity 8100

4

MediaTek Dimensity 7200 Ultra vs MediaTek Dimensity 8100

5

Qualcomm Snapdragon 7 Plus Gen 3 vs MediaTek Dimensity 8100

6

Qualcomm Snapdragon 7s Gen 2 vs MediaTek Dimensity 8100

7

Qualcomm Snapdragon 6 Gen 1 vs MediaTek Dimensity 8100

8

MediaTek Dimensity 8100 vs MediaTek Helio G25

9

MediaTek Dimensity 8100 vs Qualcomm Snapdragon 778G

10

MediaTek Dimensity 8100 vs Qualcomm Snapdragon 778G Plus