MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 780G

VS

MediaTek Dimensity 1000 Plus

Qualcomm Snapdragon 780G

Kami membandingkan dua versi SoC telefon: 8 teras 2600MHz MediaTek Dimensity 1000 Plus vs. 8 teras 2400MHz Qualcomm Snapdragon 780G. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 1000 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (0.9792 TFLOPS vs 0.7526 TFLOPS )

Lebar jalur memori yang lebih besar (29.87GB/s vs 17GB/s)

Tinggi Frekuensi (2600MHz vs 2400MHz)

Qualcomm Snapdragon 780G Kelebihan

Proses pembuatan yang lebih moden (5nm vs 7nm)

Penggunaan kuasa lebih rendah (5W berbanding 10W)

Dikeluarkan lewat 10 bulan

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 1000 Plus

523574

Qualcomm Snapdragon 780G +14%

599414

Geekbench 6 Single Core

MediaTek Dimensity 1000 Plus

1040

Qualcomm Snapdragon 780G

1045

Geekbench 6 Multi Core

MediaTek Dimensity 1000 Plus +14%

3152

Qualcomm Snapdragon 780G

2743

FP32 (float)

MediaTek Dimensity 1000 Plus +30%

979

Qualcomm Snapdragon 780G

752

MediaTek Dimensity 1000 Plus

VS

Qualcomm Snapdragon 780G

CPU

4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55

Seni bina

1x 2.4 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)

2600 MHz

Frekuensi

2400 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.2-A

-

Cache L2

2 MB

0

Cache L3

-

7 nm

Proses

5 nm

10 W

TDP

5 W

TSMC

Pembuatan

Samsung

Grafik

Mali-G77 MP9

Nama GPU

Adreno 642

850 MHz

Frekuensi GPU

490 MHz

9

Unit pelaksanaan

2

64

Unit pewarnaan

384

16

Saiz maks

12

0.9792 TFLOPS

FLOPS

0.7526 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR4X

1866 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

2x 16 Bit

29.87 Gbit/s

Lebar jalur maks

17 Gbit/s

Multimedia (ISP)

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 770

UFS 2.2

Jenis storan

UFS 2.2, UFS 3.0

2520 x 1080

Resolusi paparan maks

2520 x 1080

1x 80MP, 2x 32MP

Resolusi kamera maks

1x 192MP

4K at 30FPS

Rakaman video

4K at 30FPS

Main balik video

4K at 30FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X53

Kesambungan

LTE Cat. 19

Sokongan 4G

LTE Cat. 24

Yes

Sokongan 5G

Yes

Up to 4700 Mbps

Kelajuan muat turun

Up to 3700 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 1600 Mbps

6

Wi-Fi

6

5.1

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Mei 2020

Diumumkan

Mac 2021

Flagship

Kelas

Mid range

MT6889Z/CZA

Nombor model

SM7350-AB

MediaTek Dimensity 1000 Plus

Halaman rasmi

Qualcomm Snapdragon 780G

Perbandingan SoC Berkaitan

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2

MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 680

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MediaTek Dimensity 1000 Plus vs HiSilicon Kirin 810

4

MediaTek Dimensity 1000 Plus vs Samsung Exynos 1280

5

MediaTek Dimensity 1000 Plus vs MediaTek Helio P70

6

MediaTek Dimensity 1000 Plus vs Samsung Exynos 850

7

MediaTek Dimensity 1000 Plus vs Apple A15 Bionic

8

MediaTek Dimensity 1000 Plus vs Google Tensor

9

MediaTek Dimensity 1000 Plus vs Apple A18

10

MediaTek Dimensity 1000 Plus vs Samsung Exynos 7420