MediaTek Dimensity 1200 vs Qualcomm Snapdragon 845

VS

MediaTek Dimensity 1200 Qualcomm Snapdragon 845

Kami membandingkan dua versi SoC telefon: 8 teras 3000MHz MediaTek Dimensity 1200 vs. 8 teras 2800MHz Qualcomm Snapdragon 845. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 1200 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (0.9792 TFLOPS vs 0.727 TFLOPS )

Lebar jalur memori yang lebih besar (34.1GB/s vs 29.8GB/s)

Tinggi Frekuensi (3000MHz vs 2800MHz)

Proses pembuatan yang lebih moden (6nm vs 10nm)

Dikeluarkan lewat 3 tahun dan 1 bulan

Qualcomm Snapdragon 845 Kelebihan

Penggunaan kuasa lebih rendah (9W berbanding 10W)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 1200 +61%

722511

Qualcomm Snapdragon 845

448489

Geekbench 6 Single Core

MediaTek Dimensity 1200 +97%

1118

Qualcomm Snapdragon 845

566

Geekbench 6 Multi Core

MediaTek Dimensity 1200 +54%

3198

Qualcomm Snapdragon 845

2075

FP32 (float)

MediaTek Dimensity 1200 +34%

979

Qualcomm Snapdragon 845

727

MediaTek Dimensity 1200

VS

Qualcomm Snapdragon 845

CPU

1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

Seni bina

4x 2.8 GHz – Kryo 385 Gold (Cortex-A75)
4x 1.8 GHz – Kryo 385 Silver (Cortex-A55)

3000 MHz

Frekuensi

2800 MHz

8

Teras

8

320 KB

Cache L2

256 KB

0

Cache L3

0

6 nm

Proses

10 nm

-

Bilangan transistor

3

10 W

TDP

9 W

TSMC

Pembuatan

Samsung

Grafik

Mali-G77 MP9

Nama GPU

Adreno 630

850 MHz

Frekuensi GPU

710 MHz

9

Unit pelaksanaan

2

64

Unit pewarnaan

256

16

Saiz maks

8

0.9792 TFLOPS

FLOPS

0.727 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR4X

2133 MHz

Frekuensi memori

1866 MHz

4x 16 Bit

Bas

2x 32 Bit

34.1 Gbit/s

Lebar jalur maks

29.8 Gbit/s

AI

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 685

Multimedia (ISP)

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 685

UFS 3.1

Jenis storan

UFS 2.1

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 200MP, 2x 32MP

Resolusi kamera maks

1x 192MP

4K at 60FPS

Rakaman video

4K at 60FPS

Main balik video

4K at 60FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X20

Kesambungan

LTE Cat. 19

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

No

Up to 4700 Mbps

Kelajuan muat turun

Up to 1200 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 150 Mbps

6

Wi-Fi

5

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Info

Jan 2021

Diumumkan

Dis 2017

Flagship

Kelas

Flagship

MT6893

Nombor model

SDM845

MediaTek Dimensity 1200

Halaman rasmi

Qualcomm Snapdragon 845

Perbandingan SoC Berkaitan

1

MediaTek Dimensity 1200 vs MediaTek Dimensity 7200 Ultra

2

MediaTek Dimensity 1200 vs Qualcomm Snapdragon 6 Gen 1

3

MediaTek Dimensity 1200 vs MediaTek Dimensity 7050

4

MediaTek Dimensity 1200 vs MediaTek Dimensity 8100

5

MediaTek Dimensity 1200 vs MediaTek Dimensity 6100 Plus

6

MediaTek Dimensity 1200 vs Qualcomm Snapdragon 7 Plus Gen 2

7

MediaTek Dimensity 1200 vs MediaTek Dimensity 8200

8

Qualcomm Snapdragon 7 Gen 3 vs MediaTek Dimensity 1200

9

MediaTek Dimensity 1200 vs Qualcomm Snapdragon 660

10

MediaTek Dimensity 1200 vs MediaTek Dimensity 800U