MediaTek Dimensity 700 vs Qualcomm Snapdragon 888 Plus

VS

MediaTek Dimensity 700

Qualcomm Snapdragon 888 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 2200MHz MediaTek Dimensity 700 vs. 8 teras 2995MHz Qualcomm Snapdragon 888 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 700 Kelebihan

Penggunaan kuasa lebih rendah (6W berbanding 8W)

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.243 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 17.07GB/s)

Tinggi Frekuensi (2995MHz vs 2200MHz)

Proses pembuatan yang lebih moden (5nm vs 7nm)

Dikeluarkan lewat 7 bulan

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 700

393125

Qualcomm Snapdragon 888 Plus +112%

836957

Geekbench 6 Single Core

MediaTek Dimensity 700

715

Qualcomm Snapdragon 888 Plus +72%

1230

Geekbench 6 Multi Core

MediaTek Dimensity 700

1783

Qualcomm Snapdragon 888 Plus +111%

3778

FP32 (float)

MediaTek Dimensity 700

243

Qualcomm Snapdragon 888 Plus +662%

1853

MediaTek Dimensity 700

VS

Qualcomm Snapdragon 888 Plus

CPU

2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55

Seni bina

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

2200 MHz

Frekuensi

2995 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.4-A

1 MB

Cache L2

1 MB

0

Cache L3

0

7 nm

Proses

5 nm

-

Bilangan transistor

10.3

6 W

TDP

8 W

TSMC

Pembuatan

Samsung

Grafik

Mali-G57 MP2

Nama GPU

Adreno 660

950 MHz

Frekuensi GPU

905 MHz

2

Unit pelaksanaan

2

64

Unit pewarnaan

512

12

Saiz maks

24

0.243 TFLOPS

FLOPS

1.8534 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR5

2133 MHz

Frekuensi memori

3200 MHz

2x 16 Bit

Bas

4x 16 Bit

17.07 Gbit/s

Lebar jalur maks

51.2 Gbit/s

Multimedia (ISP)

Yes

Pemproses neural (NPU)

Hexagon 780

UFS 2.2

Jenis storan

UFS 3.0, UFS 3.1

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 64MP, 2x 16MP

Resolusi kamera maks

1x 200MP, 2x 25MP

2K at 30FPS

Rakaman video

8K at 30FPS, 4K at 120FPS

2K at 30FPS

Main balik video

8K at 30FPS

H.264, H.265, VP9

Codec video

H.264, H.265, VP8, VP9

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X60

Kesambungan

LTE Cat. 18

Sokongan 4G

LTE Cat. 22

Yes

Sokongan 5G

Yes

Up to 2770 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 1250 Mbps

Kelajuan muat naik

Up to 3000 Mbps

5

Wi-Fi

6

5.1

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Nov 2020

Diumumkan

Jun 2021

Mid range

Kelas

Flagship

MT6833V/ZA

Nombor model

SM8350-AC

MediaTek Dimensity 700

Halaman rasmi

Qualcomm Snapdragon 888 Plus

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