MediaTek Dimensity 8100 vs Qualcomm Snapdragon 865 Plus

VS

MediaTek Dimensity 8100 Qualcomm Snapdragon 865 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 2850MHz MediaTek Dimensity 8100 vs. 8 teras 3100MHz Qualcomm Snapdragon 865 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 8100 Kelebihan

Lebar jalur memori yang lebih besar (51.2GB/s vs 44GB/s)

Proses pembuatan yang lebih moden (5nm vs 7nm)

Dikeluarkan lewat 1 tahun dan 8 bulan

Qualcomm Snapdragon 865 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 1.309 TFLOPS )

Tinggi Frekuensi (3100MHz vs 2850MHz)

Penggunaan kuasa lebih rendah (5W berbanding 6W)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 8100 +8%

860129

Qualcomm Snapdragon 865 Plus

796278

Geekbench 6 Single Core

MediaTek Dimensity 8100

1145

Qualcomm Snapdragon 865 Plus +1%

1163

Geekbench 6 Multi Core

MediaTek Dimensity 8100 +9%

3633

Qualcomm Snapdragon 865 Plus

3306

FP32 (float)

MediaTek Dimensity 8100

1309

Qualcomm Snapdragon 865 Plus +4%

1372

MediaTek Dimensity 8100

VS

Qualcomm Snapdragon 865 Plus

CPU

4x 2.85 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

Seni bina

1x 3.1 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2850 MHz

Frekuensi

3100 MHz

8

Teras

8

-

Cache L2

1 MB

0

Cache L3

0

5 nm

Proses

7 nm

-

Bilangan transistor

10.3

6 W

TDP

5 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G610 MP6

Nama GPU

Adreno 650

860 MHz

Frekuensi GPU

670 MHz

6

Unit pelaksanaan

2

-

Unit pewarnaan

512

16

Saiz maks

16

1.309 TFLOPS

FLOPS

1.3721 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR5

Jenis memori

LPDDR5

3200 MHz

Frekuensi memori

2750 MHz

4x 16 Bit

Bas

4x 16 Bit

51.2 Gbit/s

Lebar jalur maks

44 Gbit/s

AI

Yes

Pemproses neural (NPU)

Hexagon 698

Multimedia (ISP)

Yes

Pemproses neural (NPU)

Hexagon 698

UFS 3.1

Jenis storan

UFS 3.0, UFS 3.1

2960 x 1440

Resolusi paparan maks

3840 x 2160

1x 200MP

Resolusi kamera maks

1x 200MP, 2x 25MP

4K at 60FPS

Rakaman video

8K at 30FPS, 4K at 60FPS

4K at 60FPS

Main balik video

8K at 30FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP8, VP9

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

MediaTek UltraSave 2.0

Modem

X55

Kesambungan

LTE Cat. 21

Sokongan 4G

LTE Cat. 22

Yes

Sokongan 5G

Yes

Up to 4700 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 3000 Mbps

6

Wi-Fi

6

5.3

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Mac 2022

Diumumkan

Jul 2020

Flagship

Kelas

Flagship

MT6895Z/TCZA

Nombor model

SM8250-AB

MediaTek Dimensity 8100

Halaman rasmi

Qualcomm Snapdragon 865 Plus

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