MediaTek Dimensity 8200 vs Qualcomm Snapdragon 888 Plus

VS

MediaTek Dimensity 8200

Qualcomm Snapdragon 888 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 3100MHz MediaTek Dimensity 8200 vs. 8 teras 2995MHz Qualcomm Snapdragon 888 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 8200 Kelebihan

Tinggi Frekuensi (3100MHz vs 2995MHz)

Proses pembuatan yang lebih moden (4nm vs 5nm)

Penggunaan kuasa lebih rendah (6W berbanding 8W)

Dikeluarkan lewat 1 tahun dan 6 bulan

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 1.442 TFLOPS )

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 8200 +7%

903370

Qualcomm Snapdragon 888 Plus

836957

Geekbench 6 Single Core

MediaTek Dimensity 8200

1229

Qualcomm Snapdragon 888 Plus

1230

Geekbench 6 Multi Core

MediaTek Dimensity 8200 +3%

3924

Qualcomm Snapdragon 888 Plus

3778

FP32 (float)

MediaTek Dimensity 8200

1442

Qualcomm Snapdragon 888 Plus +28%

1853

MediaTek Dimensity 8200

VS

Qualcomm Snapdragon 888 Plus

CPU

1x 3.1 GHz – Cortex A78
3x 3 GHz – Cortex A78
4x 2 GHz – Cortex A55

Seni bina

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

3100 MHz

Frekuensi

2995 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.4-A

-

Cache L2

1 MB

0

Cache L3

0

4 nm

Proses

5 nm

-

Bilangan transistor

10.3

6 W

TDP

8 W

TSMC

Pembuatan

Samsung

Grafik

Mali-G610 MP6

Nama GPU

Adreno 660

950 MHz

Frekuensi GPU

905 MHz

6

Unit pelaksanaan

2

-

Unit pewarnaan

512

16

Saiz maks

24

1.442 TFLOPS

FLOPS

1.8534 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

-

Versi DirectX

12.1

Memori

LPDDR5

Jenis memori

LPDDR5

3200 MHz

Frekuensi memori

3200 MHz

4x 16 Bit

Bas

4x 16 Bit

51.2 Gbit/s

Lebar jalur maks

51.2 Gbit/s

Multimedia (ISP)

MediaTek APU 580

Pemproses neural (NPU)

Hexagon 780

UFS 3.1

Jenis storan

UFS 3.0, UFS 3.1

2960 x 1440

Resolusi paparan maks

3840 x 2160

1x 320MP

Resolusi kamera maks

1x 200MP, 2x 25MP

4K at 60FPS

Rakaman video

8K at 30FPS, 4K at 120FPS

4K at 60FPS

Main balik video

8K at 30FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP8, VP9

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

MediaTek UltraSave 2.0

Modem

X60

Kesambungan

LTE Cat. 21

Sokongan 4G

LTE Cat. 22

Yes

Sokongan 5G

Yes

Up to 4700 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 3000 Mbps

6

Wi-Fi

6

5.3

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Dis 2022

Diumumkan

Jun 2021

Mid range

Kelas

Flagship

MT6896Z

Nombor model

SM8350-AC

MediaTek Dimensity 8200

Halaman rasmi

Qualcomm Snapdragon 888 Plus

Perbandingan SoC Berkaitan

1

MediaTek Dimensity 8200 vs Qualcomm Snapdragon 8s Gen 3

2

MediaTek Dimensity 8200 vs Qualcomm Snapdragon 480

3

MediaTek Dimensity 8200 vs MediaTek Dimensity 7030

4

MediaTek Dimensity 8200 vs MediaTek Helio P22

5

MediaTek Dimensity 8200 vs MediaTek Dimensity 1050

6

MediaTek Dimensity 8200 vs Samsung Exynos 7872

7

MediaTek Dimensity 8200 vs Qualcomm Snapdragon 835

8

MediaTek Dimensity 8200 vs Qualcomm Snapdragon 675

9

MediaTek Dimensity 8200 vs HiSilicon Kirin 658

10

MediaTek Dimensity 8200 vs Apple A14 Bionic