Qualcomm Snapdragon 855 Plus vs MediaTek Dimensity 1100

VS

Qualcomm Snapdragon 855 Plus MediaTek Dimensity 1100

Kami membandingkan dua versi SoC telefon: 8 teras 2960MHz Qualcomm Snapdragon 855 Plus vs. 8 teras 2600MHz MediaTek Dimensity 1100. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 855 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.0368 TFLOPS vs 0.9792 TFLOPS )

Lebar jalur memori yang lebih besar (34.13GB/s vs 34.1GB/s)

Tinggi Frekuensi (2960MHz vs 2600MHz)

Penggunaan kuasa lebih rendah (6W berbanding 10W)

MediaTek Dimensity 1100 Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Dikeluarkan lewat 1 tahun dan 6 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 855 Plus

552687

MediaTek Dimensity 1100 +42%

786669

Geekbench 6 Single Core

Qualcomm Snapdragon 855 Plus

1040

MediaTek Dimensity 1100 +6%

1107

Geekbench 6 Multi Core

Qualcomm Snapdragon 855 Plus

2865

MediaTek Dimensity 1100 +16%

3332

FP32 (float)

Qualcomm Snapdragon 855 Plus +5%

1036

MediaTek Dimensity 1100

979

Qualcomm Snapdragon 855 Plus

VS

MediaTek Dimensity 1100

CPU

1x 2.96 GHz – Cortex-A76 (Kryo 485 Gold)
3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold)
4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver)

Seni bina

4x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

2960 MHz

Frekuensi

2600 MHz

8

Teras

8

1 MB

Cache L2

320 KB

0

Cache L3

0

7 nm

Proses

6 nm

6.7

Bilangan transistor

-

6 W

TDP

10 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 640

Nama GPU

Mali-G77 MP9

675 MHz

Frekuensi GPU

850 MHz

2

Unit pelaksanaan

9

384

Unit pewarnaan

64

16

Saiz maks

16

1.0368 TFLOPS

FLOPS

0.9792 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR4X

Jenis memori

LPDDR4X

2133 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

4x 16 Bit

34.13 Gbit/s

Lebar jalur maks

34.1 Gbit/s

AI

Hexagon 690

Pemproses neural (NPU)

MediaTek APU 3.0

Multimedia (ISP)

Hexagon 690

Pemproses neural (NPU)

MediaTek APU 3.0

UFS 3.0

Jenis storan

UFS 3.1

3840 x 2160

Resolusi paparan maks

2520 x 1080

1x 192MP, 2x 22MP

Resolusi kamera maks

1x 108MP, 2x 32MP

4K at 120FPS

Rakaman video

4K at 60FPS

8K at 30FPS, 4K at 120FPS

Main balik video

4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X24 LTE, X50 5G

Modem

Helio M70

Kesambungan

LTE Cat. 20

Sokongan 4G

LTE Cat. 19

Yes

Sokongan 5G

Yes

Up to 5000 Mbps

Kelajuan muat turun

Up to 4700 Mbps

Up to 1240 Mbps

Kelajuan muat naik

Up to 2500 Mbps

6

Wi-Fi

6

5.0

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jul 2019

Diumumkan

Jan 2021

Flagship

Kelas

Flagship

SM8150-AC

Nombor model

MT6891Z/CZA

Qualcomm Snapdragon 855 Plus

Halaman rasmi

MediaTek Dimensity 1100

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