Qualcomm Snapdragon 865 Plus vs HiSilicon Kirin 990 5G

VS

Qualcomm Snapdragon 865 Plus HiSilicon Kirin 990 5G

Kami membandingkan dua versi SoC telefon: 8 teras 3100MHz Qualcomm Snapdragon 865 Plus vs. 8 teras 2860MHz HiSilicon Kirin 990 5G. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 865 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 0.6912 TFLOPS )

Lebar jalur memori yang lebih besar (44GB/s vs 34.1GB/s)

Tinggi Frekuensi (3100MHz vs 2860MHz)

Penggunaan kuasa lebih rendah (5W berbanding 6W)

Dikeluarkan lewat 9 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 865 Plus +19%

796278

HiSilicon Kirin 990 5G

665287

Geekbench 6 Single Core

Qualcomm Snapdragon 865 Plus +20%

1163

HiSilicon Kirin 990 5G

969

Geekbench 6 Multi Core

Qualcomm Snapdragon 865 Plus +4%

3306

HiSilicon Kirin 990 5G

3176

FP32 (float)

Qualcomm Snapdragon 865 Plus +98%

1372

HiSilicon Kirin 990 5G

691

Qualcomm Snapdragon 865 Plus

VS

HiSilicon Kirin 990 5G

CPU

1x 3.1 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Seni bina

2x 2.86 GHz – Cortex-A76
2x 2.36 GHz – Cortex-A76
4x 1.95 GHz – Cortex-A55

3100 MHz

Frekuensi

2860 MHz

8

Teras

8

1 MB

Cache L2

2 MB

0

Cache L3

-

7 nm

Proses

7 nm

10.3

Bilangan transistor

8

5 W

TDP

6 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 650

Nama GPU

Mali-G76 MP16

670 MHz

Frekuensi GPU

600 MHz

2

Unit pelaksanaan

16

512

Unit pewarnaan

36

16

Saiz maks

12

1.3721 TFLOPS

FLOPS

0.6912 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

2750 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

4x 16 Bit

44 Gbit/s

Lebar jalur maks

34.1 Gbit/s

AI

Hexagon 698

Pemproses neural (NPU)

Da Vinci

Multimedia (ISP)

Hexagon 698

Pemproses neural (NPU)

Da Vinci

UFS 3.0, UFS 3.1

Jenis storan

UFS 2.1, UFS 3.0

3840 x 2160

Resolusi paparan maks

3360 x 1440

1x 200MP, 2x 25MP

Resolusi kamera maks

-

8K at 30FPS, 4K at 60FPS

Rakaman video

4K at 60FPS

8K at 30FPS

Main balik video

4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X55

Modem

Balong 5000

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 24

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 4600 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 1250 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou

Info

Jul 2020

Diumumkan

Okt 2019

Flagship

Kelas

Flagship

SM8250-AB

Nombor model

-

Qualcomm Snapdragon 865 Plus

Halaman rasmi

HiSilicon Kirin 990 5G

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