Qualcomm Snapdragon 870 vs MediaTek Dimensity 1200

VS

Qualcomm Snapdragon 870

MediaTek Dimensity 1200

Kami membandingkan dua versi SoC telefon: 8 teras 3200MHz Qualcomm Snapdragon 870 vs. 8 teras 3000MHz MediaTek Dimensity 1200. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 870 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 0.9792 TFLOPS )

Lebar jalur memori yang lebih besar (44GB/s vs 34.1GB/s)

Tinggi Frekuensi (3200MHz vs 3000MHz)

Penggunaan kuasa lebih rendah (6W berbanding 10W)

MediaTek Dimensity 1200 Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 870 +12%

810488

MediaTek Dimensity 1200

722511

Geekbench 6 Single Core

Qualcomm Snapdragon 870 +2%

1151

MediaTek Dimensity 1200

1118

Geekbench 6 Multi Core

Qualcomm Snapdragon 870 +4%

3336

MediaTek Dimensity 1200

3198

FP32 (float)

Qualcomm Snapdragon 870 +40%

1372

MediaTek Dimensity 1200

979

Qualcomm Snapdragon 870

VS

MediaTek Dimensity 1200

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Seni bina

1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

3200 MHz

Frekuensi

3000 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.2-A

1 MB

Cache L2

320 KB

0

Cache L3

0

7 nm

Proses

6 nm

10.3

Bilangan transistor

-

6 W

TDP

10 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 650

Nama GPU

Mali-G77 MP9

670 MHz

Frekuensi GPU

850 MHz

2

Unit pelaksanaan

9

512

Unit pewarnaan

64

16

Saiz maks

16

1.3721 TFLOPS

FLOPS

0.9792 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

2750 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

4x 16 Bit

44 Gbit/s

Lebar jalur maks

34.1 Gbit/s

Multimedia (ISP)

Hexagon 698

Pemproses neural (NPU)

MediaTek APU 3.0

UFS 3.0, UFS 3.1

Jenis storan

UFS 3.1

3840 x 2160

Resolusi paparan maks

2520 x 1080

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 200MP, 2x 32MP

8K at 30FPS, 4K at 60FPS

Rakaman video

4K at 60FPS

8K at 30FPS, 4K at 60FPS

Main balik video

4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X55

Modem

Helio M70

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 19

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 4700 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jan 2021

Diumumkan

Jan 2021

Flagship

Kelas

Flagship

SM8250-AC

Nombor model

MT6893

Qualcomm Snapdragon 870

Halaman rasmi

MediaTek Dimensity 1200

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