Qualcomm Snapdragon 870 vs MediaTek Dimensity 900

VS

Qualcomm Snapdragon 870

MediaTek Dimensity 900

Kami membandingkan dua versi SoC telefon: 8 teras 3200MHz Qualcomm Snapdragon 870 vs. 8 teras 2400MHz MediaTek Dimensity 900. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 870 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 0.621 TFLOPS )

Lebar jalur memori yang lebih besar (44GB/s vs 18.4GB/s)

Tinggi Frekuensi (3200MHz vs 2400MHz)

MediaTek Dimensity 900 Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Penggunaan kuasa lebih rendah (4W berbanding 6W)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 870 +57%

810488

MediaTek Dimensity 900

516049

Geekbench 6 Single Core

Qualcomm Snapdragon 870 +28%

1151

MediaTek Dimensity 900

898

Geekbench 6 Multi Core

Qualcomm Snapdragon 870 +48%

3336

MediaTek Dimensity 900

2240

FP32 (float)

Qualcomm Snapdragon 870 +120%

1372

MediaTek Dimensity 900

621

Qualcomm Snapdragon 870

VS

MediaTek Dimensity 900

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Seni bina

2x 2.4 GHz – Cortex-A78
6x 2 GHz – Cortex-A55

3200 MHz

Frekuensi

2400 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.2-A

1 MB

Cache L2

-

0

Cache L3

0

7 nm

Proses

6 nm

10.3

Bilangan transistor

10

6 W

TDP

4 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 650

Nama GPU

Mali-G68 MP4

670 MHz

Frekuensi GPU

900 MHz

2

Unit pelaksanaan

4

512

Unit pewarnaan

48

16

Saiz maks

16

1.3721 TFLOPS

FLOPS

0.621 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR5

2750 MHz

Frekuensi memori

3200 MHz

4x 16 Bit

Bas

4x 16 Bit

44 Gbit/s

Lebar jalur maks

18.4 Gbit/s

Multimedia (ISP)

Hexagon 698

Pemproses neural (NPU)

Yes

UFS 3.0, UFS 3.1

Jenis storan

UFS 2.1, UFS 3.1

3840 x 2160

Resolusi paparan maks

2520 x 1080

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 108MP, 2x 20MP

8K at 30FPS, 4K at 60FPS

Rakaman video

4K at 30FPS

8K at 30FPS, 4K at 60FPS

Main balik video

4K at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

X55

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 2770 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 1250 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jan 2021

Diumumkan

Mei 2021

Flagship

Kelas

Mid range

SM8250-AC

Nombor model

MT6877

Qualcomm Snapdragon 870

Halaman rasmi

MediaTek Dimensity 900

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Qualcomm Snapdragon 870 vs MediaTek Dimensity 800U