Qualcomm Snapdragon 888 Plus vs MediaTek Helio X30

VS

Qualcomm Snapdragon 888 Plus MediaTek Helio X30

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 10 teras 2600MHz MediaTek Helio X30. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.2176 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 27.81GB/s)

Tinggi Frekuensi (2995MHz vs 2600MHz)

Proses pembuatan yang lebih moden (5nm vs 10nm)

Dikeluarkan lewat 4 tahun dan 4 bulan

MediaTek Helio X30 Kelebihan

Penggunaan kuasa lebih rendah (5W berbanding 8W)

Skor

Penanda Aras

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +266%

1230

MediaTek Helio X30

336

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +238%

3778

MediaTek Helio X30

1115

FP32 (float)

Qualcomm Snapdragon 888 Plus +753%

1853

MediaTek Helio X30

217

Qualcomm Snapdragon 888 Plus

VS

MediaTek Helio X30

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

2x 2.6 GHz – Cortex-A73
4x 2.2 GHz – Cortex-A53
4x 1.9 GHz – Cortex-A35

2995 MHz

Frekuensi

2600 MHz

8

Teras

10

1 MB

Cache L2

2 MB

0

Cache L3

-

5 nm

Proses

10 nm

10.3

Bilangan transistor

3

8 W

TDP

5 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 660

Nama GPU

PowerVR GT7400 Plus

905 MHz

Frekuensi GPU

850 MHz

2

Unit pelaksanaan

4

512

Unit pewarnaan

32

24

Saiz maks

8

1.8534 TFLOPS

FLOPS

0.2176 TFLOPS

1.1

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

11.2

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

1866 MHz

4x 16 Bit

Bas

4x 16 Bit

51.2 Gbit/s

Lebar jalur maks

27.81 Gbit/s

AI

Hexagon 780

Pemproses neural (NPU)

No

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

No

UFS 3.0, UFS 3.1

Jenis storan

eMMC 5.1, UFS 2.1

3840 x 2160

Resolusi paparan maks

2560 x 1600

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 28MP, 2x 16MP

8K at 30FPS, 4K at 120FPS

Rakaman video

4K at 30FPS

8K at 30FPS

Main balik video

4K at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP8, VP9, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AMR-NB, ADPCM, AMR-WB, OGG, WAV, MP3, MP2, AAC, AMR-NB, LAC, APE, AAC-plus v1, AAC-plus v2, WMA, ADPCM

X60

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 10

Yes

Sokongan 5G

No

Up to 7500 Mbps

Kelajuan muat turun

Up to 450 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 50 Mbps

6

Wi-Fi

5

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo

Info

Jun 2021

Diumumkan

Feb 2017

Flagship

Kelas

Flagship

SM8350-AC

Nombor model

MT6799

Qualcomm Snapdragon 888 Plus

Halaman rasmi

MediaTek Helio X30

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 888 Plus

2

Qualcomm Snapdragon 8s Gen 3 vs Qualcomm Snapdragon 888 Plus

3

Samsung Exynos 1480 vs Qualcomm Snapdragon 888 Plus

4

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 7 Gen 3

5

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 8300

6

Qualcomm Snapdragon 7s Gen 2 vs Qualcomm Snapdragon 888 Plus

7

Qualcomm Snapdragon 8 Gen 3 vs Qualcomm Snapdragon 888 Plus

8

MediaTek Helio X30 vs Qualcomm Snapdragon 888

9

Qualcomm Snapdragon 888 Plus vs Mediatek Dimensity 9300

10

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 8200