Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 670

VS

Qualcomm Snapdragon 888 Plus

Qualcomm Snapdragon 670

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 2000MHz Qualcomm Snapdragon 670. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.3584 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 14.9GB/s)

Tinggi Frekuensi (2995MHz vs 2000MHz)

Proses pembuatan yang lebih moden (5nm vs 10nm)

Penggunaan kuasa lebih rendah (8W berbanding 9W)

Dikeluarkan lewat 2 tahun dan 10 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus +234%

836957

Qualcomm Snapdragon 670

250565

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +220%

1230

Qualcomm Snapdragon 670

384

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +202%

3778

Qualcomm Snapdragon 670

1250

FP32 (float)

Qualcomm Snapdragon 888 Plus +417%

1853

Qualcomm Snapdragon 670

358

Qualcomm Snapdragon 888 Plus

VS

Qualcomm Snapdragon 670

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

2x 2 GHz – Kryo 360 Gold (Cortex-A75)
6x 1.7 GHz – Kryo 360 Silver (Cortex-A55)

2995 MHz

Frekuensi

2000 MHz

8

Teras

8

ARMv8.4-A

Set arahan

ARMv8-A

1 MB

Cache L2

-

0

Cache L3

-

5 nm

Proses

10 nm

10.3

Bilangan transistor

-

8 W

TDP

9 W

Samsung

Pembuatan

Samsung

Grafik

Adreno 660

Nama GPU

Adreno 615

905 MHz

Frekuensi GPU

700 MHz

2

Unit pelaksanaan

2

512

Unit pewarnaan

128

24

Saiz maks

8

1.8534 TFLOPS

FLOPS

0.3584 TFLOPS

1.1

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12.1

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

1866 MHz

4x 16 Bit

Bas

2x 16 Bit

51.2 Gbit/s

Lebar jalur maks

14.9 Gbit/s

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

Hexagon 685

UFS 3.0, UFS 3.1

Jenis storan

eMMC 5.1, UFS 2.1

3840 x 2160

Resolusi paparan maks

2560 x 1600

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 192MP, 2x 16MP

8K at 30FPS, 4K at 120FPS

Rakaman video

4K at 30FPS

8K at 30FPS

Main balik video

4K at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP8, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

X60

Modem

X12 LTE

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 12

Yes

Sokongan 5G

No

Up to 7500 Mbps

Kelajuan muat turun

Up to 600 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 150 Mbps

6

Wi-Fi

5

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Info

Jun 2021

Diumumkan

Ogo 2018

Flagship

Kelas

Mid range

SM8350-AC

Nombor model

SDM670

Qualcomm Snapdragon 888 Plus

Halaman rasmi

Qualcomm Snapdragon 670

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 9000E

2

Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 820

3

Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 935

4

Qualcomm Snapdragon 888 Plus vs MediaTek Helio P35

5

Qualcomm Snapdragon 888 Plus vs Samsung Exynos 9611

6

Qualcomm Snapdragon 888 Plus vs Apple A10 Fusion

7

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 6s Gen 3

8

Qualcomm Snapdragon 888 Plus vs Samsung Exynos 7570

9

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 855 Plus

10

Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 650