Qualcomm Snapdragon 888 vs HiSilicon Kirin 659

VS

Qualcomm Snapdragon 888 HiSilicon Kirin 659

Kami membandingkan dua versi SoC telefon: 8 teras 2840MHz Qualcomm Snapdragon 888 vs. 8 teras 2360MHz HiSilicon Kirin 659. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.72 TFLOPS vs 0.0576 TFLOPS )

Tinggi Frekuensi (2840MHz vs 2360MHz)

Proses pembuatan yang lebih moden (5nm vs 16nm)

Dikeluarkan lewat 3 tahun dan 11 bulan

Skor

Penanda Aras

Geekbench 6 Single Core

Qualcomm Snapdragon 888 +588%

1481

HiSilicon Kirin 659

215

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 +368%

3794

HiSilicon Kirin 659

810

FP32 (float)

Qualcomm Snapdragon 888 +2917%

1720

HiSilicon Kirin 659

57

Qualcomm Snapdragon 888

VS

HiSilicon Kirin 659

CPU

1x 2.84 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

4x 2.36 GHz – Cortex-A53
4x 1.7 GHz – Cortex-A53

2840 MHz

Frekuensi

2360 MHz

8

Teras

8

1 MB

Cache L2

-

0

Cache L3

-

5 nm

Proses

16 nm

-

Bilangan transistor

4

10 W

TDP

-

Grafik

Adreno 660

Nama GPU

Mali-T830 MP2

840 MHz

Frekuensi GPU

900 MHz

2

Unit pelaksanaan

2

512

Unit pewarnaan

16

24

Saiz maks

4

1.72 TFLOPS

FLOPS

0.0576 TFLOPS

1.1

Versi Vulkan

1.0

2.0

Versi OpenCL

1.2

12

Versi DirectX

11

Memori

LPDDR5

Jenis memori

LPDDR3

3200 MHz

Frekuensi memori

933 MHz

4x 16 Bit

Bas

2x 32 Bit

51.2 Gbit/s

Lebar jalur maks

-

AI

Hexagon 780

Pemproses neural (NPU)

No

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

No

UFS 3.0, UFS 3.1

Jenis storan

eMMC 5.1

3840 x 2160

Resolusi paparan maks

1920 x 1200

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 16MP, 2x 8MP

8K at 30FPS, 4K at 120FPS

Rakaman video

1K at 60FPS

8K at 30FPS

Main balik video

1080p at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X60

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 7

是

Sokongan 5G

No

Up to 2500 Mbps

Kelajuan muat turun

Up to 300 Mbps

Up to 316 Mbps

Kelajuan muat naik

Up to 50 Mbps

6

Wi-Fi

4

5.2

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou

Info

Dis 2020

Diumumkan

Jan 2017

Flagship

Kelas

Mid range

SM8350

Nombor model

Hi6250

Qualcomm Snapdragon 888

Halaman rasmi

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2

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3

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4

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5

Qualcomm Snapdragon 888 vs MediaTek Dimensity 6080

6

MediaTek Dimensity 7030 vs Qualcomm Snapdragon 888

7

Qualcomm Snapdragon 888 vs Qualcomm Snapdragon 7 Plus Gen 2

8

MediaTek Dimensity 6020 vs HiSilicon Kirin 659

9

Qualcomm Snapdragon 888 vs Qualcomm Snapdragon 710

10

Qualcomm Snapdragon 888 vs Samsung Exynos 8890