Intel is set to officially release Lunar Lake, also known as the Core Ultra 200V series, at midnight on September 4th. This release focuses on low-power, thin, and light devices. However, the tech community is eagerly anticipating Arrow Lake, which will debut Intel's 20A 2nm-class process, introducing a new architecture that covers both high-performance desktops and notebooks.

An internal communication from a manufacturer has sparked rumors, stating that Arrow Lake's power consumption will be at least 100W lower than the current 14th generation Core processors while maintaining high frequencies. Thanks to the new 20A process, these processors no longer require the high voltage needed in the past, ensuring stable performance.

Although specific details about Arrow Lake's performance remain confidential, it is said to be impressive. If these claims hold true, Arrow Lake could address the high voltage, power consumption, and stability issues that plagued the 13th and 14th generation Core processors, which struggled to achieve high frequencies.

Arrow Lake is expected to launch its first K-series models in October, featuring the flagship Core Ultra 9 285K. Additional desktop mainstream and notebook models are anticipated to be unveiled at CES early next year.

Current information suggests that Arrow Lake will utilize a modular architecture divided into four distinct Tile modules: CPU, SoC, GPU, and IOE. The core compute module will leverage the Intel 20A process, though details about the other modules remain undisclosed.

The CPU design continues to employ a heterogeneous hybrid architecture. The P-core architecture will be upgraded to Lion Cove, while the E-core architecture will advance to Skymont. The combination will feature up to 8 P-cores and 16 E-cores, culminating in a maximum of 24 cores and 24 threads, as threading is not supported.

The graphics core will be upgraded to the Xe2 LPG architecture, extended from Battlemage, with a maximum of 4 cores.

Additional features include the exclusive use of DDR5 memory over DDR4, an increase to 20 PCIe 5.0 lanes, native support for Thunderbolt 4, and a new LGA1851 package interface, necessitating compatibility with the latest 800-series motherboards.