CPU
GPU
SoC
Router
Categories
Rankings
CPU Rankings
GPU Rankings
SoC Rankings
Router Ranking
English
English
Close menu
Home
CPU
GPU
SoC
Router
Categories
CPU Rankings
GPU Rankings
SoC Rankings
Router Ranking
中文
English
Español
Deutsch
Français
Italiano
Português
日本語
한국어
العربية
ภาษาไทย
繁體中文
Tiếng Việt
Bahasa Melayu
中文
English
Español
Deutsch
Français
Italiano
Português
日本語
한국어
العربية
ภาษาไทย
繁體中文
Tiếng Việt
Bahasa Melayu
Home
Mobile and Tablet SoC Comparison
HiSilicon Kirin 710 vs Qualcomm Snapdragon 778G Plus
HiSilicon Kirin 710 vs Qualcomm Snapdragon 778G Plus
VS
HiSilicon Kirin 710
Qualcomm Snapdragon 778G Plus
We compared two versions of phone SoCs: 8 cores 2200MHz HiSilicon Kirin 710 vs. 8 cores 2500MHz Qualcomm Snapdragon 778G Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
Qualcomm Snapdragon 778G Plus Advantages
Better graphics card performance FLOPS (0.8448 TFLOPS vs 0.128 TFLOPS )
Higher Frequency (2500MHz vs 2200MHz)
More modern manufacturing process (6nm vs 12nm)
Released 3 years and 3 months late
Score
Benchmark
AnTuTu 10
HiSilicon Kirin 710
202054
Qualcomm Snapdragon 778G Plus
+205%
616678
Geekbench 6 Single Core
HiSilicon Kirin 710
356
Qualcomm Snapdragon 778G Plus
+200%
1069
Geekbench 6 Multi Core
HiSilicon Kirin 710
1197
Qualcomm Snapdragon 778G Plus
+151%
3008
FP32 (float)
HiSilicon Kirin 710
128
Qualcomm Snapdragon 778G Plus
+559%
844
HiSilicon Kirin 710
VS
Qualcomm Snapdragon 778G Plus
CPU
4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
Architecture
1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)
2200 MHz
Frequency
2500 MHz
8
Cores
8
ARMv8-A
Instruction set
ARMv8.4-A
512 KB
L2 cache
2 MB
0
L3 cache
-
12 nm
Process
6 nm
5.5
Transistor count
-
5 W
TDP
5 W
TSMC
Manufacturing
TSMC
Graphics
Mali-G51 MP4
GPU name
Adreno 642
1000 MHz
GPU frequency
550 MHz
4
Execution units
2
16
Shading units
384
6
Max size
16
0.128 TFLOPS
FLOPS
0.8448 TFLOPS
1.3
Vulkan version
1.1
2.0
OpenCL version
2.0
12
DirectX version
12.1
Memory
LPDDR4X
Memory type
LPDDR5
1866 MHz
Memory frequency
3200 MHz
2x 32 Bit
Bus
2x 16 Bit
-
Max bandwidth
25.6 Gbit/s
Multimedia (ISP)
No
Neural processor (NPU)
Hexagon 770
eMMC 5.1, UFS 2.1
Storage type
UFS 2.2, UFS 3.0, UFS 3.1
2340 x 1080
Max display resolution
2520 x 1080
1x 40MP, 2x 24MP
Max camera resolution
1x 192MP
1K at 30FPS
Video capture
4K at 30FPS
1080p at 60FPS
Video playback
4K at 30FPS
H.264, H.265, VP8, VP9
Video codecs
H.264, H.265, VP8, VP9
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
-
Modem
X53
Connectivity
LTE Cat. 12
4G support
LTE Cat. 24
No
5G support
Yes
Up to 600 Mbps
Download speed
Up to 3700 Mbps
Up to 150 Mbps
Upload speed
Up to 1600 Mbps
4
Wi-Fi
6
4.2
Bluetooth
5.2
GPS, GLONASS, Beidou, Galileo
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Info
Jul 2018
Announced
Oct 2021
Mid range
Class
Mid range
Hi6260
Model number
SM7325-AE
HiSilicon Kirin 710
Official page
Qualcomm Snapdragon 778G Plus
Related SoC Comparison
1
HiSilicon Kirin 710 vs MediaTek Dimensity 1000L
2
HiSilicon Kirin 710 vs Unisoc Tiger T612
3
HiSilicon Kirin 710 vs Samsung Exynos 1330
4
HiSilicon Kirin 710 vs Qualcomm Snapdragon 730G
5
HiSilicon Kirin 710 vs HiSilicon Kirin 9000
6
HiSilicon Kirin 710 vs Samsung Exynos 7872
7
HiSilicon Kirin 710 vs Samsung Exynos 2500
8
HiSilicon Kirin 710 vs MediaTek MT6580
9
HiSilicon Kirin 710 vs MediaTek Dimensity 8020
10
HiSilicon Kirin 710 vs MediaTek Dimensity 6080
© 2024 - TopCPU.net
Contact Us
Privacy Policy