HiSilicon Kirin 960 vs Qualcomm Snapdragon 855 Plus

VS

HiSilicon Kirin 960

Qualcomm Snapdragon 855 Plus

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 960 vs. 8 cores 2960MHz Qualcomm Snapdragon 855 Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

HiSilicon Kirin 960 Advantages

Lower TDP (5W vs 6W)

Qualcomm Snapdragon 855 Plus Advantages

Better graphics card performance FLOPS (1.0368 TFLOPS vs 0.2655 TFLOPS )

Larger memory bandwidth (34.13GB/s vs 28.8GB/s)

Higher Frequency (2960MHz vs 2360MHz)

More modern manufacturing process (7nm vs 16nm)

Released 2 years and 9 months late

Score

Benchmark

AnTuTu 10

HiSilicon Kirin 960

278916

Qualcomm Snapdragon 855 Plus +98%

552687

Geekbench 6 Single Core

HiSilicon Kirin 960

408

Qualcomm Snapdragon 855 Plus +154%

1040

Geekbench 6 Multi Core

HiSilicon Kirin 960

1385

Qualcomm Snapdragon 855 Plus +106%

2865

FP32 (float)

HiSilicon Kirin 960

265

Qualcomm Snapdragon 855 Plus +290%

1036

HiSilicon Kirin 960

VS

Qualcomm Snapdragon 855 Plus

CPU

4x 2.36 GHz – Cortex-A73
4x 1.84 GHz – Cortex-A53

Architecture

1x 2.96 GHz – Cortex-A76 (Kryo 485 Gold)
3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold)
4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver)

2360 MHz

Frequency

2960 MHz

8

Cores

8

ARMv8-A

Instruction set

ARMv8.2-A

4 MB

L2 cache

1 MB

-

L3 cache

0

16 nm

Process

7 nm

4

Transistor count

6.7

5 W

TDP

6 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G71 MP8

GPU name

Adreno 640

1037 MHz

GPU frequency

675 MHz

8

Execution units

2

16

Shading units

384

4

Max size

16

0.2655 TFLOPS

FLOPS

1.0368 TFLOPS

1.3

Vulkan version

1.1

2.0

OpenCL version

2.0

11.3

DirectX version

12.1

Memory

LPDDR4

Memory type

LPDDR4X

1600 MHz

Memory frequency

2133 MHz

2x 32 Bit

Bus

4x 16 Bit

28.8 Gbit/s

Max bandwidth

34.13 Gbit/s

Multimedia (ISP)

No

Neural processor (NPU)

Hexagon 690

eMMC 5.1, UFS 2.1

Storage type

UFS 3.0

2560 x 1600

Max display resolution

3840 x 2160

2x 16MP

Max camera resolution

1x 192MP, 2x 22MP

4K at 30FPS

Video capture

4K at 120FPS

4K at 30FPS

Video playback

8K at 30FPS, 4K at 120FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X24 LTE, X50 5G

Connectivity

LTE Cat. 12

4G support

LTE Cat. 20

No

5G support

Yes

Up to 600 Mbps

Download speed

Up to 5000 Mbps

Up to 150 Mbps

Upload speed

Up to 1240 Mbps

5

Wi-Fi

6

4.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Info

Oct 2016

Announced

Jul 2019

Flagship

Class

Flagship

Hi3660

Model number

SM8150-AC

-

Official page

Qualcomm Snapdragon 855 Plus

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