HiSilicon Kirin 970 vs MediaTek Dimensity 1000 Plus

VS

HiSilicon Kirin 970 MediaTek Dimensity 1000 Plus

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 970 vs. 8 cores 2600MHz MediaTek Dimensity 1000 Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

HiSilicon Kirin 970 Advantages

Lower TDP (9W vs 10W)

MediaTek Dimensity 1000 Plus Advantages

Better graphics card performance FLOPS (0.9792 TFLOPS vs 0.3318 TFLOPS )

Larger memory bandwidth (29.87GB/s vs 29.8GB/s)

Higher Frequency (2600MHz vs 2360MHz)

More modern manufacturing process (7nm vs 10nm)

Released 2 years and 8 months late

Score

Benchmark

AnTuTu 10

HiSilicon Kirin 970

355946

MediaTek Dimensity 1000 Plus +47%

523574

Geekbench 6 Single Core

HiSilicon Kirin 970

386

MediaTek Dimensity 1000 Plus +169%

1040

Geekbench 6 Multi Core

HiSilicon Kirin 970

1377

MediaTek Dimensity 1000 Plus +128%

3152

FP32 (float)

HiSilicon Kirin 970

331

MediaTek Dimensity 1000 Plus +195%

979

HiSilicon Kirin 970

VS

MediaTek Dimensity 1000 Plus

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

Architecture

4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55

2360 MHz

Frequency

2600 MHz

8

Cores

8

2 MB

L2 cache

-

0

L3 cache

0

10 nm

Process

7 nm

5.5

Transistor count

-

9 W

TDP

10 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G72 MP12

GPU name

Mali-G77 MP9

768 MHz

GPU frequency

850 MHz

12

Execution units

9

18

Shading units

64

8

Max size

16

0.3318 TFLOPS

FLOPS

0.9792 TFLOPS

1.3

Vulkan version

1.3

2.0

OpenCL version

2.0

12

DirectX version

12

Memory

LPDDR4X

Memory type

LPDDR4X

1866 MHz

Memory frequency

1866 MHz

4x 16 Bit

Bus

4x 16 Bit

29.8 Gbit/s

Max bandwidth

29.87 Gbit/s

AI

Yes

NPU

MediaTek APU 3.0

Multimedia (ISP)

Yes

Neural processor (NPU)

MediaTek APU 3.0

UFS 2.1

Storage type

UFS 2.2

3120 x 1440

Max display resolution

2520 x 1080

1x 48MP, 2x 20MP

Max camera resolution

1x 80MP, 2x 32MP

4K at 30FPS

Video capture

4K at 30FPS

Video playback

4K at 30FPS

H.264, H.265, VP8, VP9, VC-1

Video codecs

H.264, H.265, AV1, VP9

32 bit@384 kHz, HD-audio

Audio codecs

AIFF, CAF, MP3, MP4, WAV

-

Modem

Helio M70

Connectivity

LTE Cat. 18

4G support

LTE Cat. 19

No

5G support

Yes

Up to 1200 Mbps

Download speed

Up to 4700 Mbps

Up to 150 Mbps

Upload speed

Up to 2500 Mbps

5

Wi-Fi

6

4.2

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS

Info

Sep 2017

Announced

May 2020

Flagship

Class

Flagship

Hi3670

Model number

MT6889Z/CZA

HiSilicon Kirin 970

Official page

MediaTek Dimensity 1000 Plus

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