HiSilicon Kirin 970 vs Qualcomm Snapdragon 665

VS

HiSilicon Kirin 970

Qualcomm Snapdragon 665

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 970 vs. 8 cores 2000MHz Qualcomm Snapdragon 665 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

HiSilicon Kirin 970 Advantages

Better graphics card performance FLOPS (0.3318 TFLOPS vs 0.2432 TFLOPS )

Larger memory bandwidth (29.8GB/s vs 14.9GB/s)

Higher Frequency (2360MHz vs 2000MHz)

More modern manufacturing process (10nm vs 11nm)

Qualcomm Snapdragon 665 Advantages

Lower TDP (5W vs 9W)

Released 1 years and 7 months late

Score

Benchmark

AnTuTu 10

HiSilicon Kirin 970 +51%

355946

Qualcomm Snapdragon 665

235607

Geekbench 6 Single Core

HiSilicon Kirin 970 +14%

386

Qualcomm Snapdragon 665

337

Geekbench 6 Multi Core

HiSilicon Kirin 970 +17%

1377

Qualcomm Snapdragon 665

1167

FP32 (float)

HiSilicon Kirin 970 +36%

331

Qualcomm Snapdragon 665

243

HiSilicon Kirin 970

VS

Qualcomm Snapdragon 665

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

Architecture

4x 2 GHz – Kryo 260 Gold (Cortex-A73)
4x 1.8 GHz – Kryo 260 Silver (Cortex-A53)

2360 MHz

Frequency

2000 MHz

8

Cores

8

ARMv8-A

Instruction set

ARMv8-A

2 MB

L2 cache

1 MB

0

L3 cache

-

10 nm

Process

11 nm

5.5

Transistor count

1.75

9 W

TDP

5 W

TSMC

Manufacturing

Samsung

Graphics

Mali-G72 MP12

GPU name

Adreno 610

768 MHz

GPU frequency

950 MHz

12

Execution units

1

18

Shading units

128

8

Max size

8

0.3318 TFLOPS

FLOPS

0.2432 TFLOPS

1.3

Vulkan version

1.1

2.0

OpenCL version

2.0

12

DirectX version

12.1

Memory

LPDDR4X

Memory type

LPDDR4X

1866 MHz

Memory frequency

1866 MHz

4x 16 Bit

Bus

2x 16 Bit

29.8 Gbit/s

Max bandwidth

14.9 Gbit/s

Multimedia (ISP)

Yes

Neural processor (NPU)

Hexagon 686

UFS 2.1

Storage type

eMMC 5.1, UFS 2.1

3120 x 1440

Max display resolution

2520 x 1080

1x 48MP, 2x 20MP

Max camera resolution

1x 48MP, 2x 16MP

4K at 30FPS

Video capture

4K at 30FPS

Video playback

4K at 30FPS

H.264, H.265, VP8, VP9, VC-1

Video codecs

H.264, H.265, VP8, VP9

32 bit@384 kHz, HD-audio

Audio codecs

AIFF, CAF, MP3, MP4, WAV

-

Modem

X12

Connectivity

LTE Cat. 18

4G support

LTE Cat. 13

No

5G support

No

Up to 1200 Mbps

Download speed

Up to 600 Mbps

Up to 150 Mbps

Upload speed

Up to 150 Mbps

5

Wi-Fi

5

4.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Info

Sep 2017

Announced

Apr 2019

Flagship

Class

Mid range

Hi3670

Model number

SM6125

HiSilicon Kirin 970

Official page

Qualcomm Snapdragon 665

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