MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 865 Plus

VS

MediaTek Dimensity 1000 Plus Qualcomm Snapdragon 865 Plus

We compared two versions of phone SoCs: 8 cores 2600MHz MediaTek Dimensity 1000 Plus vs. 8 cores 3100MHz Qualcomm Snapdragon 865 Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 865 Plus Advantages

Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.9792 TFLOPS )

Larger memory bandwidth (44GB/s vs 29.87GB/s)

Higher Frequency (3100MHz vs 2600MHz)

Lower TDP (5W vs 10W)

Score

Benchmark

AnTuTu 10

MediaTek Dimensity 1000 Plus

523574

Qualcomm Snapdragon 865 Plus +52%

796278

Geekbench 6 Single Core

MediaTek Dimensity 1000 Plus

1040

Qualcomm Snapdragon 865 Plus +11%

1163

Geekbench 6 Multi Core

MediaTek Dimensity 1000 Plus

3152

Qualcomm Snapdragon 865 Plus +4%

3306

FP32 (float)

MediaTek Dimensity 1000 Plus

979

Qualcomm Snapdragon 865 Plus +40%

1372

MediaTek Dimensity 1000 Plus

VS

Qualcomm Snapdragon 865 Plus

CPU

4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55

Architecture

1x 3.1 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2600 MHz

Frequency

3100 MHz

8

Cores

8

-

L2 cache

1 MB

0

L3 cache

0

7 nm

Process

7 nm

-

Transistor count

10.3

10 W

TDP

5 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G77 MP9

GPU name

Adreno 650

850 MHz

GPU frequency

670 MHz

9

Execution units

2

64

Shading units

512

16

Max size

16

0.9792 TFLOPS

FLOPS

1.3721 TFLOPS

1.3

Vulkan version

1.1

2.0

OpenCL version

2.0

12

DirectX version

12.1

Memory

LPDDR4X

Memory type

LPDDR5

1866 MHz

Memory frequency

2750 MHz

4x 16 Bit

Bus

4x 16 Bit

29.87 Gbit/s

Max bandwidth

44 Gbit/s

AI

MediaTek APU 3.0

NPU

Hexagon 698

Multimedia (ISP)

MediaTek APU 3.0

Neural processor (NPU)

Hexagon 698

UFS 2.2

Storage type

UFS 3.0, UFS 3.1

2520 x 1080

Max display resolution

3840 x 2160

1x 80MP, 2x 32MP

Max camera resolution

1x 200MP, 2x 25MP

4K at 30FPS

Video capture

8K at 30FPS, 4K at 60FPS

4K at 30FPS

Video playback

8K at 30FPS

H.264, H.265, AV1, VP9

Video codecs

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X55

Connectivity

LTE Cat. 19

4G support

LTE Cat. 22

Yes

5G support

Yes

Up to 4700 Mbps

Download speed

Up to 7500 Mbps

Up to 2500 Mbps

Upload speed

Up to 3000 Mbps

6

Wi-Fi

6

5.1

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

May 2020

Announced

Jul 2020

Flagship

Class

Flagship

MT6889Z/CZA

Model number

SM8250-AB

MediaTek Dimensity 1000 Plus

Official page

Qualcomm Snapdragon 865 Plus

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