MediaTek Dimensity 7200 vs HiSilicon Kirin 970

VS

MediaTek Dimensity 7200 HiSilicon Kirin 970

We compared two versions of phone SoCs: 8 cores 2800MHz MediaTek Dimensity 7200 vs. 8 cores 2360MHz HiSilicon Kirin 970 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 7200 Advantages

Larger memory bandwidth (51.2GB/s vs 29.8GB/s)

Higher Frequency (2800MHz vs 2360MHz)

More modern manufacturing process (4nm vs 10nm)

Lower TDP (5W vs 9W)

Released 5 years and 5 months late

Score

Benchmark

AnTuTu 10

MediaTek Dimensity 7200 +100%

713781

HiSilicon Kirin 970

355946

Geekbench 6 Single Core

MediaTek Dimensity 7200 +208%

1192

HiSilicon Kirin 970

386

Geekbench 6 Multi Core

MediaTek Dimensity 7200 +92%

2645

HiSilicon Kirin 970

1377

MediaTek Dimensity 7200

VS

HiSilicon Kirin 970

CPU

2x 2.8 GHz – Cortex-A715
6x 2 GHz – Cortex-A510

Architecture

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

2800 MHz

Frequency

2360 MHz

8

Cores

8

1 MB

L2 cache

2 MB

0

L3 cache

0

4 nm

Process

10 nm

-

Transistor count

5.5

5 W

TDP

9 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G610 MP4

GPU name

Mali-G72 MP12

1130 MHz

GPU frequency

768 MHz

4

Execution units

12

-

Shading units

18

16

Max size

8

-

FLOPS

0.3318 TFLOPS

1.3

Vulkan version

1.3

2.0

OpenCL version

2.0

-

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

3200 MHz

Memory frequency

1866 MHz

4x 16 Bit

Bus

4x 16 Bit

51.2 Gbit/s

Max bandwidth

29.8 Gbit/s

AI

MediaTek APU 650

NPU

Yes

Multimedia (ISP)

MediaTek APU 650

Neural processor (NPU)

Yes

UFS 3.1

Storage type

UFS 2.1

2520 x 1080

Max display resolution

3120 x 1440

1x 200MP

Max camera resolution

1x 48MP, 2x 20MP

4K at 30FPS

Video capture

4K at 30FPS

Video playback

4K at 30FPS

H.264, H.265, VP9

Video codecs

H.264, H.265, VP8, VP9, VC-1

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Audio codecs

32 bit@384 kHz, HD-audio

Connectivity

LTE Cat. 21

4G support

LTE Cat. 18

Yes

5G support

No

Up to 4700 Mbps

Download speed

Up to 1200 Mbps

Up to 2500 Mbps

Upload speed

Up to 150 Mbps

6

Wi-Fi

5

5.3

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Feb 2023

Announced

Sep 2017

Mid range

Class

Flagship

MT6886

Model number

Hi3670

MediaTek Dimensity 7200

Official page

HiSilicon Kirin 970

Related SoC Comparison

1

MediaTek Dimensity 7200 vs MediaTek Dimensity 7050

2

MediaTek Dimensity 7200 vs Qualcomm Snapdragon 865

3

MediaTek Dimensity 7200 vs Qualcomm Snapdragon 870

4

MediaTek Dimensity 7200 vs MediaTek Dimensity 1300

5

MediaTek Dimensity 7200 vs Samsung Exynos 1480

6

MediaTek Dimensity 7200 vs MediaTek Dimensity 920

7

MediaTek Dimensity 7200 vs Qualcomm Snapdragon 6s Gen 3

8

Qualcomm Snapdragon 7s Gen 2 vs MediaTek Dimensity 7200

9

MediaTek Dimensity 7200 vs Qualcomm Snapdragon 765

10

MediaTek Dimensity 7200 vs Samsung Exynos 9820