Qualcomm Snapdragon 480 Plus vs HiSilicon Kirin 970

VS

Qualcomm Snapdragon 480 Plus

HiSilicon Kirin 970

We compared two versions of phone SoCs: 8 cores 2200MHz Qualcomm Snapdragon 480 Plus vs. 8 cores 2360MHz HiSilicon Kirin 970 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 480 Plus Advantages

Better graphics card performance FLOPS (0.4864 TFLOPS vs 0.3318 TFLOPS )

More modern manufacturing process (8nm vs 10nm)

Lower TDP (3W vs 9W)

Released 4 years and 1 months late

HiSilicon Kirin 970 Advantages

Larger memory bandwidth (29.8GB/s vs 17GB/s)

Higher Frequency (2360MHz vs 2200MHz)

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 480 Plus +2%

363972

HiSilicon Kirin 970

355946

Geekbench 6 Single Core

Qualcomm Snapdragon 480 Plus +124%

866

HiSilicon Kirin 970

386

Geekbench 6 Multi Core

Qualcomm Snapdragon 480 Plus +35%

1859

HiSilicon Kirin 970

1377

FP32 (float)

Qualcomm Snapdragon 480 Plus +46%

486

HiSilicon Kirin 970

331

Qualcomm Snapdragon 480 Plus

VS

HiSilicon Kirin 970

CPU

2x 2.2 GHz – Kryo 460 Gold (Cortex-A76)
6x 1.8 GHz – Kryo 460 Silver (Cortex-A55)

Architecture

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

2200 MHz

Frequency

2360 MHz

8

Cores

8

ARMv8-A

Instruction set

ARMv8-A

-

L2 cache

2 MB

-

L3 cache

0

8 nm

Process

10 nm

-

Transistor count

5.5

3 W

TDP

9 W

Samsung

Manufacturing

TSMC

Graphics

Adreno 619

GPU name

Mali-G72 MP12

950 MHz

GPU frequency

768 MHz

2

Execution units

12

128

Shading units

18

8

Max size

8

0.4864 TFLOPS

FLOPS

0.3318 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR4X

Memory type

LPDDR4X

2133 MHz

Memory frequency

1866 MHz

2x 16 Bit

Bus

4x 16 Bit

17 Gbit/s

Max bandwidth

29.8 Gbit/s

Multimedia (ISP)

Hexagon 686

Neural processor (NPU)

Yes

eMMC 5.1, UFS 2.2

Storage type

UFS 2.1

2520 x 1080

Max display resolution

3120 x 1440

1x 64MP, 2x 25MP

Max camera resolution

1x 48MP, 2x 20MP

1K at 60FPS

Video capture

4K at 30FPS

1080p at 60FPS

Video playback

4K at 30FPS

H.264, H.265, VP9

Video codecs

H.264, H.265, VP8, VP9, VC-1

AIFF, CAF, MP3, MP4, WAV

Audio codecs

32 bit@384 kHz, HD-audio

Snapdragon X51

Modem

-

Connectivity

LTE Cat. 18

4G support

LTE Cat. 18

Yes

5G support

No

Up to 2500 Mbps

Download speed

Up to 1200 Mbps

Up to 800 Mbps

Upload speed

Up to 150 Mbps

5

Wi-Fi

5

5.2

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Oct 2021

Announced

Sep 2017

Low end

Class

Flagship

SM4350-AC

Model number

Hi3670

Qualcomm Snapdragon 480 Plus

Official page

HiSilicon Kirin 970

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