Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 960

VS

Qualcomm Snapdragon 888 Plus

HiSilicon Kirin 960

We compared two versions of phone SoCs: 8 cores 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 cores 2360MHz HiSilicon Kirin 960 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 888 Plus Advantages

Better graphics card performance FLOPS (1.8534 TFLOPS vs 0.2655 TFLOPS )

Larger memory bandwidth (51.2GB/s vs 28.8GB/s)

Higher Frequency (2995MHz vs 2360MHz)

More modern manufacturing process (5nm vs 16nm)

Released 4 years and 8 months late

HiSilicon Kirin 960 Advantages

Lower TDP (5W vs 8W)

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 888 Plus +200%

836957

HiSilicon Kirin 960

278916

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +201%

1230

HiSilicon Kirin 960

408

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +172%

3778

HiSilicon Kirin 960

1385

FP32 (float)

Qualcomm Snapdragon 888 Plus +599%

1853

HiSilicon Kirin 960

265

Qualcomm Snapdragon 888 Plus

VS

HiSilicon Kirin 960

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Architecture

4x 2.36 GHz – Cortex-A73
4x 1.84 GHz – Cortex-A53

2995 MHz

Frequency

2360 MHz

8

Cores

8

ARMv8.4-A

Instruction set

ARMv8-A

1 MB

L2 cache

4 MB

0

L3 cache

-

5 nm

Process

16 nm

10.3

Transistor count

4

8 W

TDP

5 W

Samsung

Manufacturing

TSMC

Graphics

Adreno 660

GPU name

Mali-G71 MP8

905 MHz

GPU frequency

1037 MHz

2

Execution units

8

512

Shading units

16

24

Max size

4

1.8534 TFLOPS

FLOPS

0.2655 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

11.3

Memory

LPDDR5

Memory type

LPDDR4

3200 MHz

Memory frequency

1600 MHz

4x 16 Bit

Bus

2x 32 Bit

51.2 Gbit/s

Max bandwidth

28.8 Gbit/s

Multimedia (ISP)

Hexagon 780

Neural processor (NPU)

No

UFS 3.0, UFS 3.1

Storage type

eMMC 5.1, UFS 2.1

3840 x 2160

Max display resolution

2560 x 1600

1x 200MP, 2x 25MP

Max camera resolution

2x 16MP

8K at 30FPS, 4K at 120FPS

Video capture

4K at 30FPS

8K at 30FPS

Video playback

4K at 30FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VP8, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AIFF, CAF, MP3, MP4, WAV

X60

Modem

-

Connectivity

LTE Cat. 22

4G support

LTE Cat. 12

Yes

5G support

No

Up to 7500 Mbps

Download speed

Up to 600 Mbps

Up to 3000 Mbps

Upload speed

Up to 150 Mbps

6

Wi-Fi

5

5.2

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Jun 2021

Announced

Oct 2016

Flagship

Class

Flagship

SM8350-AC

Model number

Hi3660

Qualcomm Snapdragon 888 Plus

Official page

-

Related SoC Comparison

1

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 650

2

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 7025

3

Qualcomm Snapdragon 888 Plus vs MediaTek Helio X20

4

Qualcomm Snapdragon 888 Plus vs Samsung Exynos 7885

5

Qualcomm Snapdragon 888 Plus vs Samsung Exynos 8895

6

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 675

7

Qualcomm Snapdragon 888 Plus vs Samsung Exynos 850

8

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 632

9

Qualcomm Snapdragon 888 Plus vs MediaTek Helio P95

10

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 900