Laman Utama MediaTek Dimensity 6100 Plus

MediaTek Dimensity 6100 Plus

MediaTek Dimensity 6100 Plus
Pemproses ini dihasilkan menggunakan proses 6nm oleh TSMC, diumumkan pada Jul 2023. Ia mempunyai 8 teras, beroperasi pada frekuensi 2200MHz, dan mengintegrasikan GPU Mali-G57 MP2.

CPU

[Laporkan Masalah]
Seni bina
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Frekuensi
2200 MHz
Teras
8
Set arahan
ARMv8.2-A
Cache L1
Cache L2
1 MB
Cache L3
0
Proses
6 nm
Pembuatan
TSMC

Grafik

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Nama GPU
Mali-G57 MP2
Frekuensi GPU
950 MHz
Unit pelaksanaan
2
Unit pewarnaan
64
FLOPS
0.2432 TFLOPS
Versi Vulkan
1.3
Versi OpenCL
2.0
FLOPS
243.2 GFLOPS

Memori

[Laporkan Masalah]
Jenis memori
LPDDR4X
Frekuensi memori
2133 MHz
Bas
2x 16 Bit
Lebar jalur maks
17.07 Gbit/s

Multimedia (ISP)

[Laporkan Masalah]
Pemproses neural (NPU)
Yes
Jenis storan
UFS 2.2
Resolusi paparan maks
2520 x 1080
Resolusi kamera maks
1x 108MP, 2x 16MP
Rakaman video
2K at 30FPS
Main balik video
2K at 30FPS
Codec video
H.264, H.265, VP9
Codec audio
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Kesambungan

[Laporkan Masalah]
Sokongan 5G
Yes
Kelajuan muat turun
Up to 3300 Mbps
Wi-Fi
5
Bluetooth
5.2
Navigasi
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

[Laporkan Masalah]
Diumumkan
Jul 2023
Kelas
Mid range

Peringkat

[Laporkan Masalah]
AnTuTu 10
HiSilicon Kirin 810
HiSilicon Kirin 810 8C @ 2270 MHz
418563
MediaTek Helio G99
MediaTek Helio G99 8C @ 2200 MHz
415167
MediaTek Helio P90
MediaTek Helio P90 8C @ 2200 MHz
414755
MediaTek Dimensity 6100 Plus
413197
MediaTek Helio G95
MediaTek Helio G95 8C @ 2050 MHz
411214
Apple A11 Bionic
Apple A11 Bionic 6C @ 2390 MHz
409550
Qualcomm Snapdragon 732G
401633
Geekbench 6 Single Core
HiSilicon Kirin 810
HiSilicon Kirin 810 8C @ 2270 MHz
778
MediaTek Dimensity 720
774
MediaTek Dimensity 6080
772
Unisoc T820
Unisoc T820 8C @ 2700 MHz
764
MediaTek Dimensity 800U
759
Qualcomm Snapdragon 720G
756
Geekbench 6 Multi Core
MediaTek Helio G100
MediaTek Helio G100 8C @ 2200 MHz
2028
MediaTek Helio G99
MediaTek Helio G99 8C @ 2200 MHz
1994
HiSilicon Kirin 810
HiSilicon Kirin 810 8C @ 2270 MHz
1992
MediaTek Dimensity 6100 Plus
1965
MediaTek Dimensity 810
1945
MediaTek Dimensity 6020
1941
Samsung Exynos 1280
Samsung Exynos 1280 8C @ 2400 MHz
1927
FP32 (float)
Apple A10 Fusion
Apple A10 Fusion 4C @ 2340 MHz
249
Samsung Exynos 8890
Samsung Exynos 8890 8C @ 2300 MHz
249
Apple A9
Apple A9 2C @ 1850 MHz
249
MediaTek Dimensity 700
243
Qualcomm Snapdragon 662
243
Qualcomm Snapdragon 665
243
MediaTek Dimensity 810
243

Perbandingan Berkaitan

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