HiSilicon Kirin 990 4G vs Qualcomm Snapdragon 865

VS

HiSilicon Kirin 990 4G Qualcomm Snapdragon 865

Kami membandingkan dua versi SoC telefon: 8 teras 2860MHz HiSilicon Kirin 990 4G vs. 8 teras 2840MHz Qualcomm Snapdragon 865. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

HiSilicon Kirin 990 4G Kelebihan

Tinggi Frekuensi (2860MHz vs 2840MHz)

Qualcomm Snapdragon 865 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.2021 TFLOPS vs 0.6912 TFLOPS )

Lebar jalur memori yang lebih besar (44GB/s vs 34.1GB/s)

Penggunaan kuasa lebih rendah (5W berbanding 6W)

Skor

Penanda Aras

AnTuTu 10

HiSilicon Kirin 990 4G

695853

Qualcomm Snapdragon 865 +6%

738889

Geekbench 6 Single Core

HiSilicon Kirin 990 4G

990

Qualcomm Snapdragon 865 +13%

1128

Geekbench 6 Multi Core

HiSilicon Kirin 990 4G

3179

Qualcomm Snapdragon 865 +3%

3277

FP32 (float)

HiSilicon Kirin 990 4G

691

Qualcomm Snapdragon 865 +73%

1202

HiSilicon Kirin 990 4G

VS

Qualcomm Snapdragon 865

CPU

2x 2.86 GHz – Cortex-A76
2x 2.09 GHz – Cortex-A76
4x 1.86 GHz – Cortex-A55

Seni bina

1x 2.84 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2860 MHz

Frekuensi

2840 MHz

8

Teras

8

2 MB

Cache L2

1 MB

-

Cache L3

0

7 nm

Proses

7 nm

8

Bilangan transistor

10.3

6 W

TDP

5 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G76 MP16

Nama GPU

Adreno 650

600 MHz

Frekuensi GPU

587 MHz

16

Unit pelaksanaan

2

36

Unit pewarnaan

512

12

Saiz maks

16

0.6912 TFLOPS

FLOPS

1.2021 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR5

2133 MHz

Frekuensi memori

2750 MHz

4x 16 Bit

Bas

4x 16 Bit

34.1 Gbit/s

Lebar jalur maks

44 Gbit/s

AI

Da Vinci

Pemproses neural (NPU)

Hexagon 698

Multimedia (ISP)

Da Vinci

Pemproses neural (NPU)

Hexagon 698

UFS 2.1, UFS 3.0

Jenis storan

UFS 3.0, UFS 3.1

3360 x 1440

Resolusi paparan maks

3840 x 2160

-

Resolusi kamera maks

1x 200MP, 2x 25MP

4K at 60FPS

Rakaman video

8K at 30FPS, 4K at 60FPS

4K at 60FPS

Main balik video

8K at 30FPS, 4K at 60FPS

H.264, H.265, VC-1

Codec video

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

Balong 765

Modem

X55

Kesambungan

LTE Cat. 19

Sokongan 4G

LTE Cat. 22

No

Sokongan 5G

Yes

Up to 1400 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 200 Mbps

Kelajuan muat naik

Up to 3000 Mbps

6

Wi-Fi

6

5.0

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Okt 2019

Diumumkan

Dis 2019

Flagship

Kelas

Flagship

-

Nombor model

SM8250-AB

HiSilicon Kirin 990 4G

Halaman rasmi

Qualcomm Snapdragon 865

Perbandingan SoC Berkaitan

1

MediaTek Dimensity 8200 vs HiSilicon Kirin 990 4G

2

MediaTek Helio P22 vs HiSilicon Kirin 990 4G

3

Samsung Exynos 7420 vs HiSilicon Kirin 990 4G

4

Qualcomm Snapdragon 665 vs HiSilicon Kirin 990 4G

5

Qualcomm Snapdragon 835 vs HiSilicon Kirin 990 4G

6

MediaTek Dimensity 8300 vs HiSilicon Kirin 990 4G

7

Samsung Exynos 1480 vs HiSilicon Kirin 990 4G

8

Qualcomm Snapdragon 865 vs Samsung Exynos 1480

9

HiSilicon Kirin 990 4G vs MediaTek Dimensity 6080

10

HiSilicon Kirin 990 4G vs Samsung Exynos 7880