MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 845

VS

MediaTek Dimensity 1000 Plus

Qualcomm Snapdragon 845

Kami membandingkan dua versi SoC telefon: 8 teras 2600MHz MediaTek Dimensity 1000 Plus vs. 8 teras 2800MHz Qualcomm Snapdragon 845. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 1000 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (0.9792 TFLOPS vs 0.727 TFLOPS )

Lebar jalur memori yang lebih besar (29.87GB/s vs 29.8GB/s)

Proses pembuatan yang lebih moden (7nm vs 10nm)

Dikeluarkan lewat 2 tahun dan 5 bulan

Qualcomm Snapdragon 845 Kelebihan

Tinggi Frekuensi (2800MHz vs 2600MHz)

Penggunaan kuasa lebih rendah (9W berbanding 10W)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 1000 Plus +16%

523574

Qualcomm Snapdragon 845

448489

Geekbench 6 Single Core

MediaTek Dimensity 1000 Plus +83%

1040

Qualcomm Snapdragon 845

566

Geekbench 6 Multi Core

MediaTek Dimensity 1000 Plus +51%

3152

Qualcomm Snapdragon 845

2075

FP32 (float)

MediaTek Dimensity 1000 Plus +34%

979

Qualcomm Snapdragon 845

727

MediaTek Dimensity 1000 Plus

VS

Qualcomm Snapdragon 845

CPU

4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55

Seni bina

4x 2.8 GHz – Kryo 385 Gold (Cortex-A75)
4x 1.8 GHz – Kryo 385 Silver (Cortex-A55)

2600 MHz

Frekuensi

2800 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.2-A

-

Cache L2

256 KB

0

Cache L3

0

7 nm

Proses

10 nm

-

Bilangan transistor

3

10 W

TDP

9 W

TSMC

Pembuatan

Samsung

Grafik

Mali-G77 MP9

Nama GPU

Adreno 630

850 MHz

Frekuensi GPU

710 MHz

9

Unit pelaksanaan

2

64

Unit pewarnaan

256

16

Saiz maks

8

0.9792 TFLOPS

FLOPS

0.727 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR4X

1866 MHz

Frekuensi memori

1866 MHz

4x 16 Bit

Bas

2x 32 Bit

29.87 Gbit/s

Lebar jalur maks

29.8 Gbit/s

Multimedia (ISP)

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 685

UFS 2.2

Jenis storan

UFS 2.1

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 80MP, 2x 32MP

Resolusi kamera maks

1x 192MP

4K at 30FPS

Rakaman video

4K at 60FPS

4K at 30FPS

Main balik video

4K at 60FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X20

Kesambungan

LTE Cat. 19

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

No

Up to 4700 Mbps

Kelajuan muat turun

Up to 1200 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 150 Mbps

6

Wi-Fi

5

5.1

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Info

Mei 2020

Diumumkan

Dis 2017

Flagship

Kelas

Flagship

MT6889Z/CZA

Nombor model

SDM845

MediaTek Dimensity 1000 Plus

Halaman rasmi

Qualcomm Snapdragon 845

Perbandingan SoC Berkaitan

1

MediaTek Dimensity 1000 Plus vs MediaTek Dimensity 9200 Plus

2

MediaTek Dimensity 1000 Plus vs MediaTek Dimensity 7025

3

MediaTek Dimensity 1000 Plus vs MediaTek Helio G99

4

MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 778G Plus

5

MediaTek Dimensity 1000 Plus vs Google Tensor G4

6

MediaTek Dimensity 1000 Plus vs Samsung Exynos 7872

7

MediaTek Dimensity 1000 Plus vs Unisoc Tiger T618

8

MediaTek Dimensity 1000 Plus vs Apple A13 Bionic

9

MediaTek Dimensity 1000 Plus vs MediaTek Dimensity 9400

10

MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 801