MediaTek Dimensity 1200 vs Qualcomm Snapdragon 855

VS

MediaTek Dimensity 1200 Qualcomm Snapdragon 855

Kami membandingkan dua versi SoC telefon: 8 teras 3000MHz MediaTek Dimensity 1200 vs. 8 teras 2840MHz Qualcomm Snapdragon 855. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 1200 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (0.9792 TFLOPS vs 0.8985 TFLOPS )

Tinggi Frekuensi (3000MHz vs 2840MHz)

Proses pembuatan yang lebih moden (6nm vs 7nm)

Dikeluarkan lewat 2 tahun dan 1 bulan

Qualcomm Snapdragon 855 Kelebihan

Lebar jalur memori yang lebih besar (34.13GB/s vs 34.1GB/s)

Penggunaan kuasa lebih rendah (6W berbanding 10W)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 1200 +22%

722511

Qualcomm Snapdragon 855

592031

Geekbench 6 Single Core

MediaTek Dimensity 1200 +19%

1118

Qualcomm Snapdragon 855

939

Geekbench 6 Multi Core

MediaTek Dimensity 1200 +12%

3198

Qualcomm Snapdragon 855

2855

FP32 (float)

MediaTek Dimensity 1200 +9%

979

Qualcomm Snapdragon 855

898

MediaTek Dimensity 1200

VS

Qualcomm Snapdragon 855

CPU

1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

Seni bina

1x 2.84 GHz – Cortex-A76 (Kryo 485 Gold)
3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold)
4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver)

3000 MHz

Frekuensi

2840 MHz

8

Teras

8

320 KB

Cache L2

1 MB

0

Cache L3

0

6 nm

Proses

7 nm

-

Bilangan transistor

6.7

10 W

TDP

6 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G77 MP9

Nama GPU

Adreno 640

850 MHz

Frekuensi GPU

585 MHz

9

Unit pelaksanaan

2

64

Unit pewarnaan

384

16

Saiz maks

16

0.9792 TFLOPS

FLOPS

0.8985 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR4X

2133 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

4x 16 Bit

34.1 Gbit/s

Lebar jalur maks

34.13 Gbit/s

AI

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 690

Multimedia (ISP)

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 690

UFS 3.1

Jenis storan

UFS 3.0

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 200MP, 2x 32MP

Resolusi kamera maks

1x 192MP, 2x 22MP

4K at 60FPS

Rakaman video

4K at 120FPS

4K at 60FPS

Main balik video

8K at 30FPS, 4K at 120FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X24 LTE, X50 5G

Kesambungan

LTE Cat. 19

Sokongan 4G

LTE Cat. 20

Yes

Sokongan 5G

Yes

Up to 4700 Mbps

Kelajuan muat turun

Up to 5000 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 1240 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Info

Jan 2021

Diumumkan

Dis 2018

Flagship

Kelas

Flagship

MT6893

Nombor model

SM8150

MediaTek Dimensity 1200

Halaman rasmi

Qualcomm Snapdragon 855

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