MediaTek Dimensity 1300 vs Qualcomm Snapdragon 855 Plus

VS

MediaTek Dimensity 1300 Qualcomm Snapdragon 855 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 3000MHz MediaTek Dimensity 1300 vs. 8 teras 2960MHz Qualcomm Snapdragon 855 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 1300 Kelebihan

Tinggi Frekuensi (3000MHz vs 2960MHz)

Proses pembuatan yang lebih moden (6nm vs 7nm)

Dikeluarkan lewat 2 tahun dan 8 bulan

Qualcomm Snapdragon 855 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.0368 TFLOPS vs 0.9792 TFLOPS )

Lebar jalur memori yang lebih besar (34.13GB/s vs 34.1GB/s)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 1300 +26%

698511

Qualcomm Snapdragon 855 Plus

552687

Geekbench 6 Single Core

MediaTek Dimensity 1300 +20%

1252

Qualcomm Snapdragon 855 Plus

1040

Geekbench 6 Multi Core

MediaTek Dimensity 1300 +20%

3457

Qualcomm Snapdragon 855 Plus

2865

FP32 (float)

MediaTek Dimensity 1300

979

Qualcomm Snapdragon 855 Plus +5%

1036

MediaTek Dimensity 1300

VS

Qualcomm Snapdragon 855 Plus

CPU

1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

Seni bina

1x 2.96 GHz – Cortex-A76 (Kryo 485 Gold)
3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold)
4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver)

3000 MHz

Frekuensi

2960 MHz

8

Teras

8

-

Cache L2

1 MB

-

Cache L3

0

6 nm

Proses

7 nm

-

Bilangan transistor

6.7

-

TDP

6 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G77 MP9

Nama GPU

Adreno 640

850 MHz

Frekuensi GPU

675 MHz

9

Unit pelaksanaan

2

64

Unit pewarnaan

384

16

Saiz maks

16

0.9792 TFLOPS

FLOPS

1.0368 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR4X

2133 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

4x 16 Bit

34.1 Gbit/s

Lebar jalur maks

34.13 Gbit/s

AI

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 690

Multimedia (ISP)

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 690

UFS 3.1

Jenis storan

UFS 3.0

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 200MP

Resolusi kamera maks

1x 192MP, 2x 22MP

4K at 60FPS

Rakaman video

4K at 120FPS

4K at 60FPS

Main balik video

8K at 30FPS, 4K at 120FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X24 LTE, X50 5G

Kesambungan

LTE Cat. 19

Sokongan 4G

LTE Cat. 20

Yes

Sokongan 5G

Yes

Up to 4700 Mbps

Kelajuan muat turun

Up to 5000 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 1240 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Info

Mac 2022

Diumumkan

Jul 2019

Flagship

Kelas

Flagship

MT6893Z

Nombor model

SM8150-AC

MediaTek Dimensity 1300

Halaman rasmi

Qualcomm Snapdragon 855 Plus

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