AMD is gearing up to unveil its sixth-generation EPYC processors, dubbed "Venice," in 2026. These forthcoming processors will leverage AMD's innovative Zen 6 and Zen 6C core architectures, manufactured using TSMC's cutting-edge 2nm process technology. These advancements are expected to bring significant improvements in core count, cache capacity, and power efficiency, catering to a range of applications in cloud computing, artificial intelligence, and enterprise solutions.

The Venice series will offer two distinct core architectures: the standard Zen 6 and the denser Zen 6C. The Zen 6 cores are tailored for high-performance demands, emphasizing single-thread performance and frequency, while the Zen 6C is optimized for thread-intensive, multicore tasks. The flagship model is anticipated to boast 256 Zen 6C cores along with 512 threads, marking a 33% increase in core count from the previous fifth-generation EPYC Turin's maximum of 192 Zen 5C cores. In contrast, the standard Zen 6 version will feature up to 96 cores and 192 threads, aligning with the Turin's Zen 5 model but with considerably enhanced performance and efficiency enabled by the new architecture and process.

Built as a multi-chip module (MCM), the processor will accommodate up to eight compute chips (CCDs), each integrating 12 Zen 6 cores or more Zen 6C cores. Each CCD is equipped with an impressive 128MB of Level 3 cache (L3), which doubles the maximum 64MB per CCD seen in Turin, totaling 1024MB of cache. This architecture enhances memory access speeds, particularly benefiting memory-sensitive workloads like database management and machine learning inference. Zen 6C cores are allocated approximately 2MB of L3 cache per core, optimizing cache efficiency for demanding applications, while Zen 6 cores offer higher single-core cache ratios to support elevated frequencies and complex computational tasks.

The Venice series will support new SP7 and SP8 socket platforms. SP7 targets high-end, dual-socket servers, accommodating up to 256 Zen 6C cores with a thermal design power (TDP) of up to 600W, a 50% increase from Turin's 400W, reflecting higher core density and performance needs. Meanwhile, the SP8 is designed for single and entry-level servers with a maximum of 128 Zen 6C cores and a TDP ranging from 350 to 400W, balancing performance with energy efficiency. The SP7 platform will support 16-channel DDR5 memory, whereas the SP8 will support 12-channel, ensuring high-bandwidth memory access to meet a variety of data center requirements. Additionally, Venice is set to support PCIe 5.0 and CXL 2.0 for improved I/O performance and memory scalability.

TSMC's 2nm process (N2) featuring NanoSheet technology offers superior power efficiency by either boosting performance by approximately 15% or cutting power consumption by 25% compared to the 3nm process. Combined with the Zen 6 architecture, this process enhances the processor's instruction per clock (IPC) rate by an estimated 10-15% for enterprise and cloud workloads, with potentially greater gains in high-performance computing (HPC) and AI tasks, contingent on optimizations. Moreover, the 2nm process improves transistor density, allowing for higher core integration and smaller die sizes, which in turn reduces production costs.

The Venice processors will span a wide array of configurations from 8 cores to 256 cores, meeting diverse needs ranging from edge computing to hyperscale data centers. The flagship EPYC 9006 (Zen 6C) offers 256 cores and 512 threads tailored for virtualization, containerization, and AI training; mid-tier models may offer 64 or 96 cores optimized for databases and enterprise applications; and entry-level models are designed for telecom and embedded systems. AMD is also expected to continue utilizing the Infinity Fabric interconnect architecture to ensure high-bandwidth, low-latency communications between chips and processors, enhancing the scalability of multiplexed systems.

In comparison to its predecessor, Venice places a heightened focus on modularity and architectural flexibility. While the 8 CCD layout is a reduction from Turin's maximum of 16 CCDs, this actually results in a performance boost due to increased cache capacity and optimized core designs. AMD might also introduce a novel branch predictor and instruction prefetching mechanism to further minimize latency and improve execution efficiency for complex workloads. Additionally, the processor will maintain comprehensive support for the AVX-512 instruction set, enhancing capabilities in AI and scientific computing.

Since its inception in 2017, AMD's EPYC line has grown its market share from 2% in 2018 to an impressive 34% in 2024, driven by high core counts, low power consumption, and cost benefits. The release of Venice is anticipated to further cement AMD's competitive positioning in the server market against Intel's Xeon lineup. Intel is expected to introduce Diamond Rapids processors based on the Panther Cove-X architecture this year, potentially featuring up to 200 cores, but AMD's advancements in process technology and cache capacity may give it an edge in power efficiency and multi-thread performance.

Currently, Venice is advancing through flow and entering the production validation phase. AMD's collaboration with TSMC is crucial for ensuring stable volume production of the 2nm process, with the first chips slated for production at TSMC's Fab 21 facility in Arizona. In the upcoming months, AMD may disclose additional SKU specifics and performance metrics to provide data center customers with an outlined upgrade path. The launch of Venice not only reflects AMD's sustained innovation in high-performance computing but aims to propel data centers toward enhanced efficiency and computational density.