Home Comparison Qualcomm Snapdragon X Plus vs Intel Core Ultra 9 185H

Qualcomm Snapdragon X Plus vs Intel Core Ultra 9 185H

We compared two laptop CPUs: Qualcomm Snapdragon X Plus with 10 cores 3.4GHz and Intel Core Ultra 9 185H with 16 cores 2.3GHz . You will find out which processor performs better in benchmark tests, key specifications, power consumption and more.

Main Differences

Qualcomm Snapdragon X Plus 's Advantages
Higher specification of memory (8448 vs 7467)
Larger memory bandwidth (135GB/s vs 120GB/s)
Higher base frequency (3.4GHz vs 2.3GHz)
Larger L3 cache size (42MB vs 24MB)
More modern manufacturing process (4nm vs 7nm)
Lower TDP (23W vs 65W)
Intel Core Ultra 9 185H 's Advantages
Better graphics card performance
Newer PCIe version (5.0 vs 4.0)

Score

Benchmark

Cinebench R23 Single Core
Qualcomm Snapdragon X Plus
1488
Intel Core Ultra 9 185H +22%
1824
Cinebench R23 Multi Core
Qualcomm Snapdragon X Plus
11931
Intel Core Ultra 9 185H +46%
17531
Geekbench 6 Single Core
Qualcomm Snapdragon X Plus
2347
Intel Core Ultra 9 185H +4%
2447
Geekbench 6 Multi Core
Qualcomm Snapdragon X Plus
12973
Intel Core Ultra 9 185H +4%
13618
Cinebench 2024 Single Core
Qualcomm Snapdragon X Plus
109
Intel Core Ultra 9 185H
109
Cinebench 2024 Multi Core
Qualcomm Snapdragon X Plus
845
Intel Core Ultra 9 185H +26%
1070
Blender
Qualcomm Snapdragon X Plus +12%
360
Intel Core Ultra 9 185H
319
Passmark CPU Single Core
Qualcomm Snapdragon X Plus
3208
Intel Core Ultra 9 185H +17%
3755
Passmark CPU Multi Core
Qualcomm Snapdragon X Plus
21685
Intel Core Ultra 9 185H +28%
27826
VS

General Parameters

Apr 2024
Release Date
Dec 2023
Qualcomm
Manufacturer
Intel
Laptop
Type
Laptop
ARMv9
Instruction Set
x86-64
Snapdragon X
Core Architecture
Meteor Lake
X1P-64-100
Processor Number
185H
Custom
Socket
FCBGA-2049
Qualcomm Adreno X1
Integrated Graphics
Arc Graphics (8-Cores)
Oryon
Generation
Ultra 9 (Meteor Lake)

Package

4 nm
Manufacturing Process
7 nm
23 W
Power Consumption
35-65 W
80 W
Max Turbo Power Consumption
115 W
Peak Operating Temperature
110°C
Samsung TSMC
Foundry
Intel
mm²
Die Size
-

CPU Performance

10
Performance Cores
6
10
Performance Core Threads
12
3.4 GHz
Performance Core Base Frequency
2.3 GHz
3.4 GHz
Performance Core Turbo Frequency
5.1 GHz
-
Efficiency Cores
10
-
Efficiency Core Threads
10
-
Efficiency Core Base Frequency
1.8 GHz
-
Efficiency Core Turbo Frequency
3.8 GHz
10
Total Core Count
16
10
Total Thread Count
22
100 MHz
Bus Frequency
100 MHz
34x
Multiplier
23x
-
L1 Cache
112 K per core
-
L2 Cache
2 MB per core
42 MB
L3 Cache
24 MB shared
No
Unlocked Multiplier
No
1
SMP
1

Memory Parameters

LPDDR5X-8448
Memory Types
LPDDR5-7467, LPDDR5x-7467, DDR5-5600
64 GB
Max Memory Size
96 GB
8
Max Memory Channels
2
135 GB/s
Max Memory Bandwidth
120 GB/s
No
ECC Memory Support
No

Graphics Card Parameters

true
Integrated Graphics
true
500 MHz
GPU Base Frequency
-
1200 MHz
GPU Max Dynamic Frequency
2350 MHz
1536
Shader Units
128
48
Texture Units
8
6
Raster Operation Units
4
6
Execution Units
8
Power Consumption
-
-
Max Resolution
7680x4320 - 60 Hz
3.8 TFLOPS
Graphics Performance
5.76 TFLOPS

Miscellaneous

4.0
PCIe Version
5.0
PCIe Lanes
28

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