HiSilicon Kirin 970 vs MediaTek Dimensity 8100

VS

HiSilicon Kirin 970 MediaTek Dimensity 8100

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 970 vs. 8 cores 2850MHz MediaTek Dimensity 8100 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 8100 Advantages

Better graphics card performance FLOPS (1.309 TFLOPS vs 0.3318 TFLOPS )

Larger memory bandwidth (51.2GB/s vs 29.8GB/s)

Higher Frequency (2850MHz vs 2360MHz)

More modern manufacturing process (5nm vs 10nm)

Lower TDP (6W vs 9W)

Released 4 years and 6 months late

Score

Benchmark

AnTuTu 10

HiSilicon Kirin 970

355946

MediaTek Dimensity 8100 +141%

860129

Geekbench 6 Single Core

HiSilicon Kirin 970

386

MediaTek Dimensity 8100 +196%

1145

Geekbench 6 Multi Core

HiSilicon Kirin 970

1377

MediaTek Dimensity 8100 +163%

3633

FP32 (float)

HiSilicon Kirin 970

331

MediaTek Dimensity 8100 +295%

1309

HiSilicon Kirin 970

VS

MediaTek Dimensity 8100

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

Architecture

4x 2.85 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

2360 MHz

Frequency

2850 MHz

8

Cores

8

2 MB

L2 cache

-

0

L3 cache

0

10 nm

Process

5 nm

5.5

Transistor count

-

9 W

TDP

6 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G72 MP12

GPU name

Mali-G610 MP6

768 MHz

GPU frequency

860 MHz

12

Execution units

6

18

Shading units

-

8

Max size

16

0.3318 TFLOPS

FLOPS

1.309 TFLOPS

1.3

Vulkan version

1.3

2.0

OpenCL version

2.0

12

DirectX version

12

Memory

LPDDR4X

Memory type

LPDDR5

1866 MHz

Memory frequency

3200 MHz

4x 16 Bit

Bus

4x 16 Bit

29.8 Gbit/s

Max bandwidth

51.2 Gbit/s

AI

Yes

NPU

Yes

Multimedia (ISP)

Yes

Neural processor (NPU)

Yes

UFS 2.1

Storage type

UFS 3.1

3120 x 1440

Max display resolution

2960 x 1440

1x 48MP, 2x 20MP

Max camera resolution

1x 200MP

4K at 30FPS

Video capture

4K at 60FPS

4K at 30FPS

Video playback

4K at 60FPS

H.264, H.265, VP8, VP9, VC-1

Video codecs

H.264, H.265, AV1, VP9

32 bit@384 kHz, HD-audio

Audio codecs

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

-

Modem

MediaTek UltraSave 2.0

Connectivity

LTE Cat. 18

4G support

LTE Cat. 21

No

5G support

Yes

Up to 1200 Mbps

Download speed

Up to 4700 Mbps

Up to 150 Mbps

Upload speed

Up to 2500 Mbps

5

Wi-Fi

6

4.2

Bluetooth

5.3

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Sep 2017

Announced

Mar 2022

Flagship

Class

Flagship

Hi3670

Model number

MT6895Z/TCZA

HiSilicon Kirin 970

Official page

MediaTek Dimensity 8100

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