HiSilicon Kirin 970 vs Qualcomm Snapdragon 778G Plus

VS

HiSilicon Kirin 970

Qualcomm Snapdragon 778G Plus

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 970 vs. 8 cores 2500MHz Qualcomm Snapdragon 778G Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

HiSilicon Kirin 970 Advantages

Larger memory bandwidth (29.8GB/s vs 25.6GB/s)

Qualcomm Snapdragon 778G Plus Advantages

Better graphics card performance FLOPS (0.8448 TFLOPS vs 0.3318 TFLOPS )

Higher Frequency (2500MHz vs 2360MHz)

More modern manufacturing process (6nm vs 10nm)

Lower TDP (5W vs 9W)

Released 4 years and 1 months late

Score

Benchmark

AnTuTu 10

HiSilicon Kirin 970

355946

Qualcomm Snapdragon 778G Plus +73%

616678

Geekbench 6 Single Core

HiSilicon Kirin 970

386

Qualcomm Snapdragon 778G Plus +176%

1069

Geekbench 6 Multi Core

HiSilicon Kirin 970

1377

Qualcomm Snapdragon 778G Plus +118%

3008

FP32 (float)

HiSilicon Kirin 970

331

Qualcomm Snapdragon 778G Plus +154%

844

HiSilicon Kirin 970

VS

Qualcomm Snapdragon 778G Plus

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

Architecture

1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)

2360 MHz

Frequency

2500 MHz

8

Cores

8

ARMv8-A

Instruction set

ARMv8.4-A

2 MB

L2 cache

2 MB

0

L3 cache

-

10 nm

Process

6 nm

5.5

Transistor count

-

9 W

TDP

5 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G72 MP12

GPU name

Adreno 642

768 MHz

GPU frequency

550 MHz

12

Execution units

2

18

Shading units

384

8

Max size

16

0.3318 TFLOPS

FLOPS

0.8448 TFLOPS

1.3

Vulkan version

1.1

2.0

OpenCL version

2.0

12

DirectX version

12.1

Memory

LPDDR4X

Memory type

LPDDR5

1866 MHz

Memory frequency

3200 MHz

4x 16 Bit

Bus

2x 16 Bit

29.8 Gbit/s

Max bandwidth

25.6 Gbit/s

Multimedia (ISP)

Yes

Neural processor (NPU)

Hexagon 770

UFS 2.1

Storage type

UFS 2.2, UFS 3.0, UFS 3.1

3120 x 1440

Max display resolution

2520 x 1080

1x 48MP, 2x 20MP

Max camera resolution

1x 192MP

4K at 30FPS

Video capture

4K at 30FPS

Video playback

4K at 30FPS

H.264, H.265, VP8, VP9, VC-1

Video codecs

H.264, H.265, VP8, VP9

32 bit@384 kHz, HD-audio

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X53

Connectivity

LTE Cat. 18

4G support

LTE Cat. 24

No

5G support

Yes

Up to 1200 Mbps

Download speed

Up to 3700 Mbps

Up to 150 Mbps

Upload speed

Up to 1600 Mbps

5

Wi-Fi

6

4.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Sep 2017

Announced

Oct 2021

Flagship

Class

Mid range

Hi3670

Model number

SM7325-AE

HiSilicon Kirin 970

Official page

Qualcomm Snapdragon 778G Plus

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