Home Mobile and Tablet SoC Comparison Qualcomm Snapdragon 870 vs HiSilicon Kirin 710

Qualcomm Snapdragon 870 vs HiSilicon Kirin 710

Qualcomm Snapdragon 870
VS
HiSilicon Kirin 710
Qualcomm Snapdragon 870
HiSilicon Kirin 710
We compared two versions of phone SoCs: 8 cores 3200MHz Qualcomm Snapdragon 870 vs. 8 cores 2200MHz HiSilicon Kirin 710 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 870 Advantages
Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.128 TFLOPS )
Higher Frequency (3200MHz vs 2200MHz)
More modern manufacturing process (7nm vs 12nm)
Released 2 years and 6 months late
HiSilicon Kirin 710 Advantages
Lower TDP (5W vs 6W)

Score

Benchmark

AnTuTu 10
Qualcomm Snapdragon 870 +301%
810488
HiSilicon Kirin 710
202054
Geekbench 6 Single Core
Qualcomm Snapdragon 870 +223%
1151
HiSilicon Kirin 710
356
Geekbench 6 Multi Core
Qualcomm Snapdragon 870 +178%
3336
HiSilicon Kirin 710
1197
FP32 (float)
Qualcomm Snapdragon 870 +971%
1372
HiSilicon Kirin 710
128
Qualcomm Snapdragon 870
VS
HiSilicon Kirin 710

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
Architecture
4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
3200 MHz
Frequency
2200 MHz
8
Cores
8
ARMv8.2-A
Instruction set
ARMv8-A
1 MB
L2 cache
512 KB
0
L3 cache
0
7 nm
Process
12 nm
10.3
Transistor count
5.5
6 W
TDP
5 W
TSMC
Manufacturing
TSMC

Graphics

Adreno 650
GPU name
Mali-G51 MP4
670 MHz
GPU frequency
1000 MHz
2
Execution units
4
512
Shading units
16
16
Max size
6
1.3721 TFLOPS
FLOPS
0.128 TFLOPS
1.1
Vulkan version
1.3
2.0
OpenCL version
2.0
12.1
DirectX version
12

Memory

LPDDR5
Memory type
LPDDR4X
2750 MHz
Memory frequency
1866 MHz
4x 16 Bit
Bus
2x 32 Bit
44 Gbit/s
Max bandwidth
-

Multimedia (ISP)

Hexagon 698
Neural processor (NPU)
No
UFS 3.0, UFS 3.1
Storage type
eMMC 5.1, UFS 2.1
3840 x 2160
Max display resolution
2340 x 1080
1x 200MP, 2x 25MP
Max camera resolution
1x 40MP, 2x 24MP
8K at 30FPS, 4K at 60FPS
Video capture
1K at 30FPS
8K at 30FPS, 4K at 60FPS
Video playback
1080p at 60FPS
H.264, H.265, VP8, VP9
Video codecs
H.264, H.265, VP8, VP9
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
AIFF, CAF, MP3, MP4, WAV
X55
Modem
-

Connectivity

LTE Cat. 22
4G support
LTE Cat. 12
Yes
5G support
No
Up to 7500 Mbps
Download speed
Up to 600 Mbps
Up to 3000 Mbps
Upload speed
Up to 150 Mbps
6
Wi-Fi
4
5.2
Bluetooth
4.2
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo

Info

Jan 2021
Announced
Jul 2018
Flagship
Class
Mid range
SM8250-AC
Model number
Hi6260
Qualcomm Snapdragon 870
Official page
HiSilicon Kirin 710

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