Qualcomm Snapdragon 870 vs MediaTek Dimensity 1000 Plus

VS

Qualcomm Snapdragon 870

MediaTek Dimensity 1000 Plus

We compared two versions of phone SoCs: 8 cores 3200MHz Qualcomm Snapdragon 870 vs. 8 cores 2600MHz MediaTek Dimensity 1000 Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 870 Advantages

Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.9792 TFLOPS )

Larger memory bandwidth (44GB/s vs 29.87GB/s)

Higher Frequency (3200MHz vs 2600MHz)

Lower TDP (6W vs 10W)

Released 8 months late

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 870 +54%

810488

MediaTek Dimensity 1000 Plus

523574

Geekbench 6 Single Core

Qualcomm Snapdragon 870 +10%

1151

MediaTek Dimensity 1000 Plus

1040

Geekbench 6 Multi Core

Qualcomm Snapdragon 870 +5%

3336

MediaTek Dimensity 1000 Plus

3152

FP32 (float)

Qualcomm Snapdragon 870 +40%

1372

MediaTek Dimensity 1000 Plus

979

Qualcomm Snapdragon 870

VS

MediaTek Dimensity 1000 Plus

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Architecture

4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55

3200 MHz

Frequency

2600 MHz

8

Cores

8

ARMv8.2-A

Instruction set

ARMv8.2-A

1 MB

L2 cache

-

0

L3 cache

0

7 nm

Process

7 nm

10.3

Transistor count

-

6 W

TDP

10 W

TSMC

Manufacturing

TSMC

Graphics

Adreno 650

GPU name

Mali-G77 MP9

670 MHz

GPU frequency

850 MHz

2

Execution units

9

512

Shading units

64

16

Max size

16

1.3721 TFLOPS

FLOPS

0.9792 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

2750 MHz

Memory frequency

1866 MHz

4x 16 Bit

Bus

4x 16 Bit

44 Gbit/s

Max bandwidth

29.87 Gbit/s

Multimedia (ISP)

Hexagon 698

Neural processor (NPU)

MediaTek APU 3.0

UFS 3.0, UFS 3.1

Storage type

UFS 2.2

3840 x 2160

Max display resolution

2520 x 1080

1x 200MP, 2x 25MP

Max camera resolution

1x 80MP, 2x 32MP

8K at 30FPS, 4K at 60FPS

Video capture

4K at 30FPS

8K at 30FPS, 4K at 60FPS

Video playback

4K at 30FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AIFF, CAF, MP3, MP4, WAV

X55

Modem

Helio M70

Connectivity

LTE Cat. 22

4G support

LTE Cat. 19

Yes

5G support

Yes

Up to 7500 Mbps

Download speed

Up to 4700 Mbps

Up to 3000 Mbps

Upload speed

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS

Info

Jan 2021

Announced

May 2020

Flagship

Class

Flagship

SM8250-AC

Model number

MT6889Z/CZA

Qualcomm Snapdragon 870

Official page

MediaTek Dimensity 1000 Plus

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