Home Mobile and Tablet SoC Comparison Qualcomm Snapdragon 870 vs HiSilicon Kirin 960

Qualcomm Snapdragon 870 vs HiSilicon Kirin 960

Qualcomm Snapdragon 870
VS
HiSilicon Kirin 960
Qualcomm Snapdragon 870 HiSilicon Kirin 960
We compared two versions of phone SoCs: 8 cores 3200MHz Qualcomm Snapdragon 870 vs. 8 cores 2360MHz HiSilicon Kirin 960 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 870 Advantages
Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.2655 TFLOPS )
Larger memory bandwidth (44GB/s vs 28.8GB/s)
Higher Frequency (3200MHz vs 2360MHz)
More modern manufacturing process (7nm vs 16nm)
Released 4 years and 3 months late
HiSilicon Kirin 960 Advantages
Lower TDP (5W vs 6W)

Score

Benchmark

AnTuTu 10
Qualcomm Snapdragon 870 +190%
810488
HiSilicon Kirin 960
278916
Geekbench 6 Single Core
Qualcomm Snapdragon 870 +182%
1151
HiSilicon Kirin 960
408
Geekbench 6 Multi Core
Qualcomm Snapdragon 870 +140%
3336
HiSilicon Kirin 960
1385
FP32 (float)
Qualcomm Snapdragon 870 +417%
1372
HiSilicon Kirin 960
265
Qualcomm Snapdragon 870
VS
HiSilicon Kirin 960

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
Architecture
4x 2.36 GHz – Cortex-A73
4x 1.84 GHz – Cortex-A53
3200 MHz
Frequency
2360 MHz
8
Cores
8
1 MB
L2 cache
4 MB
0
L3 cache
-
7 nm
Process
16 nm
10.3
Transistor count
4
6 W
TDP
5 W
TSMC
Manufacturing
TSMC

Graphics

Adreno 650
GPU name
Mali-G71 MP8
670 MHz
GPU frequency
1037 MHz
2
Execution units
8
512
Shading units
16
16
Max size
4
1.3721 TFLOPS
FLOPS
0.2655 TFLOPS
1.1
Vulkan version
1.3
2.0
OpenCL version
2.0
12.1
DirectX version
11.3

Memory

LPDDR5
Memory type
LPDDR4
2750 MHz
Memory frequency
1600 MHz
4x 16 Bit
Bus
2x 32 Bit
44 Gbit/s
Max bandwidth
28.8 Gbit/s

AI

Hexagon 698
NPU
No

Multimedia (ISP)

Hexagon 698
Neural processor (NPU)
No
UFS 3.0, UFS 3.1
Storage type
eMMC 5.1, UFS 2.1
3840 x 2160
Max display resolution
2560 x 1600
1x 200MP, 2x 25MP
Max camera resolution
2x 16MP
8K at 30FPS, 4K at 60FPS
Video capture
4K at 30FPS
8K at 30FPS, 4K at 60FPS
Video playback
4K at 30FPS
H.264, H.265, VP8, VP9
Video codecs
H.264, H.265, VP8, VP9
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
AIFF, CAF, MP3, MP4, WAV
X55
Modem
-

Connectivity

LTE Cat. 22
4G support
LTE Cat. 12
Yes
5G support
No
Up to 7500 Mbps
Download speed
Up to 600 Mbps
Up to 3000 Mbps
Upload speed
Up to 150 Mbps
6
Wi-Fi
5
5.2
Bluetooth
4.2
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo

Info

Jan 2021
Announced
Oct 2016
Flagship
Class
Flagship
SM8250-AC
Model number
Hi3660
Qualcomm Snapdragon 870
Official page
-

Related SoC Comparison

1
Qualcomm Snapdragon 7s Gen 2 vs Qualcomm Snapdragon 870
2
Qualcomm Snapdragon 870 vs Qualcomm Snapdragon 8 Gen 3
3
Qualcomm Snapdragon 870 vs Qualcomm Snapdragon 8 Gen 1
4
MediaTek Helio G99 vs Qualcomm Snapdragon 870
5
Samsung Exynos 1380 vs Qualcomm Snapdragon 870
6
MediaTek Dimensity 7050 vs Qualcomm Snapdragon 870
7
Qualcomm Snapdragon 685 vs Qualcomm Snapdragon 870
8
MediaTek Helio G99 vs HiSilicon Kirin 960
9
Qualcomm Snapdragon 870 vs Apple A12 Bionic
10
Qualcomm Snapdragon 870 vs Apple A17 Pro
© 2024 - TopCPU.net   Contact Us Privacy Policy