Qualcomm Snapdragon 870 vs MediaTek Dimensity 9000 Plus

VS

Qualcomm Snapdragon 870 MediaTek Dimensity 9000 Plus

We compared two versions of phone SoCs: 8 cores 3200MHz Qualcomm Snapdragon 870 vs. 8 cores 3200MHz MediaTek Dimensity 9000 Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 9000 Plus Advantages

Better graphics card performance FLOPS (1.7913 TFLOPS vs 1.3721 TFLOPS )

Larger memory bandwidth (60GB/s vs 44GB/s)

More modern manufacturing process (4nm vs 7nm)

Lower TDP (4W vs 6W)

Released 1 years and 6 months late

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 870

810488

MediaTek Dimensity 9000 Plus +47%

1193511

Geekbench 6 Single Core

Qualcomm Snapdragon 870

1151

MediaTek Dimensity 9000 Plus +43%

1654

Geekbench 6 Multi Core

Qualcomm Snapdragon 870

3336

MediaTek Dimensity 9000 Plus +35%

4517

FP32 (float)

Qualcomm Snapdragon 870

1372

MediaTek Dimensity 9000 Plus +30%

1791

Qualcomm Snapdragon 870

VS

MediaTek Dimensity 9000 Plus

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Architecture

1x 3.2 GHz – Cortex-X2
3x 2.85 GHz – Cortex-A710
4x 1.8 GHz – Cortex-A510

3200 MHz

Frequency

3200 MHz

8

Cores

8

1 MB

L2 cache

1 MB

0

L3 cache

0

7 nm

Process

4 nm

10.3

Transistor count

-

6 W

TDP

4 W

TSMC

Manufacturing

TSMC

Graphics

Adreno 650

GPU name

Mali-G710 MP10

670 MHz

GPU frequency

933 MHz

2

Execution units

10

512

Shading units

96

16

Max size

24

1.3721 TFLOPS

FLOPS

1.7913 TFLOPS

1.1

Vulkan version

1.1

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR5X

2750 MHz

Memory frequency

3750 MHz

4x 16 Bit

Bus

4x 16 Bit

44 Gbit/s

Max bandwidth

60 Gbit/s

AI

Hexagon 698

NPU

MediaTek APU 590

Multimedia (ISP)

Hexagon 698

Neural processor (NPU)

MediaTek APU 590

UFS 3.0, UFS 3.1

Storage type

UFS 3.1

3840 x 2160

Max display resolution

2960 x 1440

1x 200MP, 2x 25MP

Max camera resolution

1x 320MP, 3x 32MP

8K at 30FPS, 4K at 60FPS

Video capture

4K at 60FPS

8K at 30FPS, 4K at 60FPS

Video playback

4K at 60FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

X55

Modem

-

Connectivity

LTE Cat. 22

4G support

LTE Cat. 24

Yes

5G support

Yes

Up to 7500 Mbps

Download speed

Up to 7000 Mbps

Up to 3000 Mbps

Upload speed

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.3

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Jan 2021

Announced

Jul 2022

Flagship

Class

Flagship

SM8250-AC

Model number

MT6983Z

Qualcomm Snapdragon 870

Official page

MediaTek Dimensity 9000 Plus

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