Qualcomm Snapdragon 870 vs MediaTek Dimensity 9000 Plus

VS

Qualcomm Snapdragon 870 MediaTek Dimensity 9000 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 3200MHz Qualcomm Snapdragon 870 vs. 8 teras 3200MHz MediaTek Dimensity 9000 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 9000 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.7913 TFLOPS vs 1.3721 TFLOPS )

Lebar jalur memori yang lebih besar (60GB/s vs 44GB/s)

Proses pembuatan yang lebih moden (4nm vs 7nm)

Penggunaan kuasa lebih rendah (4W berbanding 6W)

Dikeluarkan lewat 1 tahun dan 6 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 870

810488

MediaTek Dimensity 9000 Plus +47%

1193511

Geekbench 6 Single Core

Qualcomm Snapdragon 870

1151

MediaTek Dimensity 9000 Plus +43%

1654

Geekbench 6 Multi Core

Qualcomm Snapdragon 870

3336

MediaTek Dimensity 9000 Plus +35%

4517

FP32 (float)

Qualcomm Snapdragon 870

1372

MediaTek Dimensity 9000 Plus +30%

1791

Qualcomm Snapdragon 870

VS

MediaTek Dimensity 9000 Plus

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Seni bina

1x 3.2 GHz – Cortex-X2
3x 2.85 GHz – Cortex-A710
4x 1.8 GHz – Cortex-A510

3200 MHz

Frekuensi

3200 MHz

8

Teras

8

1 MB

Cache L2

1 MB

0

Cache L3

0

7 nm

Proses

4 nm

10.3

Bilangan transistor

-

6 W

TDP

4 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 650

Nama GPU

Mali-G710 MP10

670 MHz

Frekuensi GPU

933 MHz

2

Unit pelaksanaan

10

512

Unit pewarnaan

96

16

Saiz maks

24

1.3721 TFLOPS

FLOPS

1.7913 TFLOPS

1.1

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR5X

2750 MHz

Frekuensi memori

3750 MHz

4x 16 Bit

Bas

4x 16 Bit

44 Gbit/s

Lebar jalur maks

60 Gbit/s

AI

Hexagon 698

Pemproses neural (NPU)

MediaTek APU 590

Multimedia (ISP)

Hexagon 698

Pemproses neural (NPU)

MediaTek APU 590

UFS 3.0, UFS 3.1

Jenis storan

UFS 3.1

3840 x 2160

Resolusi paparan maks

2960 x 1440

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 320MP, 3x 32MP

8K at 30FPS, 4K at 60FPS

Rakaman video

4K at 60FPS

8K at 30FPS, 4K at 60FPS

Main balik video

4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

X55

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 24

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 7000 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.3

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Jan 2021

Diumumkan

Jul 2022

Flagship

Kelas

Flagship

SM8250-AC

Nombor model

MT6983Z

Qualcomm Snapdragon 870

Halaman rasmi

MediaTek Dimensity 9000 Plus

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 870 vs Qualcomm Snapdragon 8 Gen 3

2

Qualcomm Snapdragon 870 vs MediaTek Dimensity 8200

3

Qualcomm Snapdragon 870 vs Qualcomm Snapdragon 8 Gen 1

4

Qualcomm Snapdragon 870 vs MediaTek Dimensity 7200 Ultra

5

Qualcomm Snapdragon 870 vs MediaTek Dimensity 7050

6

Qualcomm Snapdragon 870 vs MediaTek Dimensity 9000

7

Qualcomm Snapdragon 870 vs Qualcomm Snapdragon 8 Gen 2

8

Qualcomm Snapdragon 7s Gen 2 vs Qualcomm Snapdragon 870

9

Qualcomm Snapdragon 870 vs Qualcomm Snapdragon 8 Gen 2

10

Qualcomm Snapdragon 870 vs Qualcomm Snapdragon 480