HiSilicon Kirin 810 vs Qualcomm Snapdragon 865 Plus

VS

HiSilicon Kirin 810 Qualcomm Snapdragon 865 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 2270MHz HiSilicon Kirin 810 vs. 8 teras 3100MHz Qualcomm Snapdragon 865 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 865 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 0.2362 TFLOPS )

Lebar jalur memori yang lebih besar (44GB/s vs 31.78GB/s)

Tinggi Frekuensi (3100MHz vs 2270MHz)

Dikeluarkan lewat 1 tahun dan 1 bulan

Skor

Penanda Aras

AnTuTu 10

HiSilicon Kirin 810

418563

Qualcomm Snapdragon 865 Plus +90%

796278

Geekbench 6 Single Core

HiSilicon Kirin 810

778

Qualcomm Snapdragon 865 Plus +49%

1163

Geekbench 6 Multi Core

HiSilicon Kirin 810

1992

Qualcomm Snapdragon 865 Plus +65%

3306

FP32 (float)

HiSilicon Kirin 810

236

Qualcomm Snapdragon 865 Plus +481%

1372

HiSilicon Kirin 810

VS

Qualcomm Snapdragon 865 Plus

CPU

2x 2.27 GHz – Cortex-A76
6x 1.9 GHz – Cortex-A55

Seni bina

1x 3.1 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2270 MHz

Frekuensi

3100 MHz

8

Teras

8

1 MB

Cache L2

1 MB

-

Cache L3

0

7 nm

Proses

7 nm

6.9

Bilangan transistor

10.3

5 W

TDP

5 W

-

Pembuatan

TSMC

Grafik

Mali-G52 MP6

Nama GPU

Adreno 650

820 MHz

Frekuensi GPU

670 MHz

6

Unit pelaksanaan

2

24

Unit pewarnaan

512

8

Saiz maks

16

0.2362 TFLOPS

FLOPS

1.3721 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR5

2133 MHz

Frekuensi memori

2750 MHz

4x 16 Bit

Bas

4x 16 Bit

31.78 Gbit/s

Lebar jalur maks

44 Gbit/s

AI

Yes

Pemproses neural (NPU)

Hexagon 698

Multimedia (ISP)

Yes

Pemproses neural (NPU)

Hexagon 698

eMMC 5.1, UFS 2.1

Jenis storan

UFS 3.0, UFS 3.1

3840 x 2160

Resolusi paparan maks

3840 x 2160

1x 48MP, 2x 20MP

Resolusi kamera maks

1x 200MP, 2x 25MP

1K at 30FPS

Rakaman video

8K at 30FPS, 4K at 60FPS

1080p at 60FPS

Main balik video

8K at 30FPS

H.264, H.265

Codec video

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X55

Kesambungan

LTE Cat. 12

Sokongan 4G

LTE Cat. 22

No

Sokongan 5G

Yes

Up to 600 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 150 Mbps

Kelajuan muat naik

Up to 3000 Mbps

6

Wi-Fi

6

5.0

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Jun 2019

Diumumkan

Jul 2020

Mid range

Kelas

Flagship

Hi6280

Nombor model

SM8250-AB

HiSilicon Kirin 810

Halaman rasmi

Qualcomm Snapdragon 865 Plus

Perbandingan SoC Berkaitan

1

MediaTek Helio G99 vs HiSilicon Kirin 810

2

HiSilicon Kirin 810 vs Qualcomm Snapdragon 680

3

Qualcomm Snapdragon 6 Gen 1 vs HiSilicon Kirin 810

4

Qualcomm Snapdragon 685 vs HiSilicon Kirin 810

5

HiSilicon Kirin 650 vs HiSilicon Kirin 810

6

Qualcomm Snapdragon 7s Gen 2 vs HiSilicon Kirin 810

7

MediaTek Dimensity 6100 Plus vs HiSilicon Kirin 810

8

Qualcomm Snapdragon 6 Gen 1 vs Qualcomm Snapdragon 865 Plus

9

HiSilicon Kirin 810 vs MediaTek Dimensity 9400

10

HiSilicon Kirin 810 vs MediaTek Dimensity 6300