MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888 Plus

VS

MediaTek Dimensity 7050

Qualcomm Snapdragon 888 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 2600MHz MediaTek Dimensity 7050 vs. 8 teras 2995MHz Qualcomm Snapdragon 888 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 7050 Kelebihan

Penggunaan kuasa lebih rendah (4W berbanding 8W)

Dikeluarkan lewat 1 tahun dan 11 bulan

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.686 TFLOPS )

Tinggi Frekuensi (2995MHz vs 2600MHz)

Proses pembuatan yang lebih moden (5nm vs 6nm)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 7050

535270

Qualcomm Snapdragon 888 Plus +56%

836957

Geekbench 6 Single Core

MediaTek Dimensity 7050

962

Qualcomm Snapdragon 888 Plus +27%

1230

Geekbench 6 Multi Core

MediaTek Dimensity 7050

2364

Qualcomm Snapdragon 888 Plus +59%

3778

FP32 (float)

MediaTek Dimensity 7050

686

Qualcomm Snapdragon 888 Plus +170%

1853

MediaTek Dimensity 7050

VS

Qualcomm Snapdragon 888 Plus

CPU

2x 2.6 GHz – Cortex-A78
6x 2 GHz – Cortex-A55

Seni bina

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

2600 MHz

Frekuensi

2995 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.4-A

-

Cache L2

1 MB

-

Cache L3

0

6 nm

Proses

5 nm

-

Bilangan transistor

10.3

4 W

TDP

8 W

TSMC

Pembuatan

Samsung

Grafik

Mali-G68 MP4

Nama GPU

Adreno 660

800 MHz

Frekuensi GPU

905 MHz

4

Unit pelaksanaan

2

-

Unit pewarnaan

512

16

Saiz maks

24

0.686 TFLOPS

FLOPS

1.8534 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

-

Versi DirectX

12.1

Memori

LPDDR5

Jenis memori

LPDDR5

3200 MHz

Frekuensi memori

3200 MHz

4x 16 Bit

Bas

4x 16 Bit

-

Lebar jalur maks

51.2 Gbit/s

Multimedia (ISP)

MediaTek APU 550

Pemproses neural (NPU)

Hexagon 780

UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1

Jenis storan

UFS 3.0, UFS 3.1

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 200MP

Resolusi kamera maks

1x 200MP, 2x 25MP

4K at 30FPS

Rakaman video

8K at 30FPS, 4K at 120FPS

4K at 30FPS

Main balik video

8K at 30FPS

H.264, H.265, VP9

Codec video

H.264, H.265, VP8, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X60

Kesambungan

LTE Cat. 18

Sokongan 4G

LTE Cat. 22

Yes

Sokongan 5G

Yes

Up to 2770 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 1250 Mbps

Kelajuan muat naik

Up to 3000 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Mei 2023

Diumumkan

Jun 2021

Mid range

Kelas

Flagship

MT6877 MT6877V/TTZA

Nombor model

SM8350-AC

MediaTek Dimensity 7050

Halaman rasmi

Qualcomm Snapdragon 888 Plus

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