Qualcomm Snapdragon 778G Plus vs MediaTek Dimensity 1200

VS

Qualcomm Snapdragon 778G Plus MediaTek Dimensity 1200

Kami membandingkan dua versi SoC telefon: 8 teras 2500MHz Qualcomm Snapdragon 778G Plus vs. 8 teras 3000MHz MediaTek Dimensity 1200. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 778G Plus Kelebihan

Penggunaan kuasa lebih rendah (5W berbanding 10W)

Dikeluarkan lewat 9 bulan

MediaTek Dimensity 1200 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (0.9792 TFLOPS vs 0.8448 TFLOPS )

Lebar jalur memori yang lebih besar (34.1GB/s vs 25.6GB/s)

Tinggi Frekuensi (3000MHz vs 2500MHz)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 778G Plus

616678

MediaTek Dimensity 1200 +17%

722511

Geekbench 6 Single Core

Qualcomm Snapdragon 778G Plus

1069

MediaTek Dimensity 1200 +4%

1118

Geekbench 6 Multi Core

Qualcomm Snapdragon 778G Plus

3008

MediaTek Dimensity 1200 +6%

3198

FP32 (float)

Qualcomm Snapdragon 778G Plus

844

MediaTek Dimensity 1200 +15%

979

Qualcomm Snapdragon 778G Plus

VS

MediaTek Dimensity 1200

CPU

1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)

Seni bina

1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

2500 MHz

Frekuensi

3000 MHz

8

Teras

8

2 MB

Cache L2

320 KB

-

Cache L3

0

6 nm

Proses

6 nm

5 W

TDP

10 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 642

Nama GPU

Mali-G77 MP9

550 MHz

Frekuensi GPU

850 MHz

2

Unit pelaksanaan

9

384

Unit pewarnaan

64

16

Saiz maks

16

0.8448 TFLOPS

FLOPS

0.9792 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

2133 MHz

2x 16 Bit

Bas

4x 16 Bit

25.6 Gbit/s

Lebar jalur maks

34.1 Gbit/s

AI

Hexagon 770

Pemproses neural (NPU)

MediaTek APU 3.0

Multimedia (ISP)

Hexagon 770

Pemproses neural (NPU)

MediaTek APU 3.0

UFS 2.2, UFS 3.0, UFS 3.1

Jenis storan

UFS 3.1

2520 x 1080

Resolusi paparan maks

2520 x 1080

1x 192MP

Resolusi kamera maks

1x 200MP, 2x 32MP

4K at 30FPS

Rakaman video

4K at 60FPS

4K at 30FPS

Main balik video

4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X53

Modem

Helio M70

Kesambungan

LTE Cat. 24

Sokongan 4G

LTE Cat. 19

Yes

Sokongan 5G

Yes

Up to 3700 Mbps

Kelajuan muat turun

Up to 4700 Mbps

Up to 1600 Mbps

Kelajuan muat naik

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Okt 2021

Diumumkan

Jan 2021

Mid range

Kelas

Flagship

SM7325-AE

Nombor model

MT6893

Qualcomm Snapdragon 778G Plus

Halaman rasmi

MediaTek Dimensity 1200

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