Qualcomm Snapdragon 865 Plus vs HiSilicon Kirin 970

VS

Qualcomm Snapdragon 865 Plus

HiSilicon Kirin 970

Kami membandingkan dua versi SoC telefon: 8 teras 3100MHz Qualcomm Snapdragon 865 Plus vs. 8 teras 2360MHz HiSilicon Kirin 970. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 865 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 0.3318 TFLOPS )

Lebar jalur memori yang lebih besar (44GB/s vs 29.8GB/s)

Tinggi Frekuensi (3100MHz vs 2360MHz)

Proses pembuatan yang lebih moden (7nm vs 10nm)

Penggunaan kuasa lebih rendah (5W berbanding 9W)

Dikeluarkan lewat 2 tahun dan 10 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 865 Plus +123%

796278

HiSilicon Kirin 970

355946

Geekbench 6 Single Core

Qualcomm Snapdragon 865 Plus +201%

1163

HiSilicon Kirin 970

386

Geekbench 6 Multi Core

Qualcomm Snapdragon 865 Plus +140%

3306

HiSilicon Kirin 970

1377

FP32 (float)

Qualcomm Snapdragon 865 Plus +314%

1372

HiSilicon Kirin 970

331

Qualcomm Snapdragon 865 Plus

VS

HiSilicon Kirin 970

CPU

1x 3.1 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Seni bina

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

3100 MHz

Frekuensi

2360 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8-A

1 MB

Cache L2

2 MB

0

Cache L3

0

7 nm

Proses

10 nm

10.3

Bilangan transistor

5.5

5 W

TDP

9 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 650

Nama GPU

Mali-G72 MP12

670 MHz

Frekuensi GPU

768 MHz

2

Unit pelaksanaan

12

512

Unit pewarnaan

18

16

Saiz maks

8

1.3721 TFLOPS

FLOPS

0.3318 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

2750 MHz

Frekuensi memori

1866 MHz

4x 16 Bit

Bas

4x 16 Bit

44 Gbit/s

Lebar jalur maks

29.8 Gbit/s

Multimedia (ISP)

Hexagon 698

Pemproses neural (NPU)

Yes

UFS 3.0, UFS 3.1

Jenis storan

UFS 2.1

3840 x 2160

Resolusi paparan maks

3120 x 1440

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 48MP, 2x 20MP

8K at 30FPS, 4K at 60FPS

Rakaman video

4K at 30FPS

8K at 30FPS

Main balik video

4K at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP8, VP9, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

32 bit@384 kHz, HD-audio

X55

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

No

Up to 7500 Mbps

Kelajuan muat turun

Up to 1200 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 150 Mbps

6

Wi-Fi

5

5.2

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo

Info

Jul 2020

Diumumkan

Sep 2017

Flagship

Kelas

Flagship

SM8250-AB

Nombor model

Hi3670

Qualcomm Snapdragon 865 Plus

Halaman rasmi

HiSilicon Kirin 970

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 865 Plus vs Apple A10 Fusion

2

Qualcomm Snapdragon 865 Plus vs Qualcomm Snapdragon 8 Elite

3

Qualcomm Snapdragon 865 Plus vs MediaTek Dimensity 7030

4

Qualcomm Snapdragon 865 Plus vs Qualcomm Snapdragon 636

5

Qualcomm Snapdragon 865 Plus vs Samsung Exynos 7880

6

Qualcomm Snapdragon 865 Plus vs Qualcomm Snapdragon 865

7

Qualcomm Snapdragon 865 Plus vs Qualcomm Snapdragon 835

8

Qualcomm Snapdragon 865 Plus vs MediaTek Dimensity 8100

9

Qualcomm Snapdragon 865 Plus vs Qualcomm Snapdragon 730G

10

Qualcomm Snapdragon 865 Plus vs MediaTek Dimensity 7020