Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 9000

VS

Qualcomm Snapdragon 888 Plus

HiSilicon Kirin 9000

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 3130MHz HiSilicon Kirin 9000. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Lebar jalur memori yang lebih besar (51.2GB/s vs 44GB/s)

Dikeluarkan lewat 8 bulan

HiSilicon Kirin 9000 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (2.3316 TFLOPS vs 1.8534 TFLOPS )

Tinggi Frekuensi (3130MHz vs 2995MHz)

Penggunaan kuasa lebih rendah (6W berbanding 8W)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus

836957

HiSilicon Kirin 9000 +8%

907784

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus

1230

HiSilicon Kirin 9000 +2%

1266

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +7%

3778

HiSilicon Kirin 9000

3529

FP32 (float)

Qualcomm Snapdragon 888 Plus

1853

HiSilicon Kirin 9000 +25%

2331

Qualcomm Snapdragon 888 Plus

VS

HiSilicon Kirin 9000

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55

2995 MHz

Frekuensi

3130 MHz

8

Teras

8

ARMv8.4-A

Set arahan

ARMv8.2-A

1 MB

Cache L2

-

0

Cache L3

-

5 nm

Proses

5 nm

10.3

Bilangan transistor

15.3

8 W

TDP

6 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 660

Nama GPU

Mali-G78 MP24

905 MHz

Frekuensi GPU

759 MHz

2

Unit pelaksanaan

24

512

Unit pewarnaan

64

24

Saiz maks

16

1.8534 TFLOPS

FLOPS

2.3316 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR5

3200 MHz

Frekuensi memori

2750 MHz

4x 16 Bit

Bas

4x 16 Bit

51.2 Gbit/s

Lebar jalur maks

44 Gbit/s

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

AI accelerator

UFS 3.0, UFS 3.1

Jenis storan

UFS 3.1

3840 x 2160

Resolusi paparan maks

3840 x 2160

1x 200MP, 2x 25MP

Resolusi kamera maks

-

8K at 30FPS, 4K at 120FPS

Rakaman video

4K at 60FPS

8K at 30FPS

Main balik video

4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

X60

Modem

Balong 5000

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 24

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 4600 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, NAVIC

Info

Jun 2021

Diumumkan

Okt 2020

Flagship

Kelas

Flagship

SM8350-AC

Nombor model

-

Qualcomm Snapdragon 888 Plus

Halaman rasmi

HiSilicon Kirin 9000

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 690

2

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 865

3

Qualcomm Snapdragon 888 Plus vs MediaTek Helio G36

4

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 865 Plus

5

Qualcomm Snapdragon 888 Plus vs Unisoc SC9863A

6

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 860

7

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 855 Plus

8

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 7020

9

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 920

10

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 855