Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 990 4G

VS

Qualcomm Snapdragon 888 Plus HiSilicon Kirin 990 4G

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 2860MHz HiSilicon Kirin 990 4G. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.6912 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 34.1GB/s)

Tinggi Frekuensi (2995MHz vs 2860MHz)

Proses pembuatan yang lebih moden (5nm vs 7nm)

Dikeluarkan lewat 1 tahun dan 8 bulan

HiSilicon Kirin 990 4G Kelebihan

Penggunaan kuasa lebih rendah (6W berbanding 8W)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus +20%

836957

HiSilicon Kirin 990 4G

695853

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +24%

1230

HiSilicon Kirin 990 4G

990

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +18%

3778

HiSilicon Kirin 990 4G

3179

FP32 (float)

Qualcomm Snapdragon 888 Plus +168%

1853

HiSilicon Kirin 990 4G

691

Qualcomm Snapdragon 888 Plus

VS

HiSilicon Kirin 990 4G

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

2x 2.86 GHz – Cortex-A76
2x 2.09 GHz – Cortex-A76
4x 1.86 GHz – Cortex-A55

2995 MHz

Frekuensi

2860 MHz

8

Teras

8

1 MB

Cache L2

2 MB

0

Cache L3

-

5 nm

Proses

7 nm

10.3

Bilangan transistor

8

8 W

TDP

6 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 660

Nama GPU

Mali-G76 MP16

905 MHz

Frekuensi GPU

600 MHz

2

Unit pelaksanaan

16

512

Unit pewarnaan

36

24

Saiz maks

12

1.8534 TFLOPS

FLOPS

0.6912 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

4x 16 Bit

51.2 Gbit/s

Lebar jalur maks

34.1 Gbit/s

AI

Hexagon 780

Pemproses neural (NPU)

Da Vinci

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

Da Vinci

UFS 3.0, UFS 3.1

Jenis storan

UFS 2.1, UFS 3.0

3840 x 2160

Resolusi paparan maks

3360 x 1440

1x 200MP, 2x 25MP

Resolusi kamera maks

-

8K at 30FPS, 4K at 120FPS

Rakaman video

4K at 60FPS

8K at 30FPS

Main balik video

4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X60

Modem

Balong 765

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 19

Yes

Sokongan 5G

No

Up to 7500 Mbps

Kelajuan muat turun

Up to 1400 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 200 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo

Info

Jun 2021

Diumumkan

Okt 2019

Flagship

Kelas

Flagship

SM8350-AC

Nombor model

-

Qualcomm Snapdragon 888 Plus

Halaman rasmi

HiSilicon Kirin 990 4G

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 8300

2

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 7 Gen 3

3

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 6 Gen 1

4

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 7300

5

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 8 Gen 4

6

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 8 Gen 1

7

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 6300

8

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 888 Plus

9

Qualcomm Snapdragon 888 Plus vs Google Tensor

10

Qualcomm Snapdragon 888 Plus vs Apple A18 Pro