Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 7050

VS

Qualcomm Snapdragon 888 Plus

MediaTek Dimensity 7050

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 2600MHz MediaTek Dimensity 7050. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.686 TFLOPS )

Tinggi Frekuensi (2995MHz vs 2600MHz)

Proses pembuatan yang lebih moden (5nm vs 6nm)

MediaTek Dimensity 7050 Kelebihan

Penggunaan kuasa lebih rendah (4W berbanding 8W)

Dikeluarkan lewat 1 tahun dan 11 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus +56%

836957

MediaTek Dimensity 7050

535270

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +27%

1230

MediaTek Dimensity 7050

962

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +59%

3778

MediaTek Dimensity 7050

2364

FP32 (float)

Qualcomm Snapdragon 888 Plus +170%

1853

MediaTek Dimensity 7050

686

Qualcomm Snapdragon 888 Plus

VS

MediaTek Dimensity 7050

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

2x 2.6 GHz – Cortex-A78
6x 2 GHz – Cortex-A55

2995 MHz

Frekuensi

2600 MHz

8

Teras

8

ARMv8.4-A

Set arahan

ARMv8.2-A

1 MB

Cache L2

-

0

Cache L3

-

5 nm

Proses

6 nm

10.3

Bilangan transistor

-

8 W

TDP

4 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 660

Nama GPU

Mali-G68 MP4

905 MHz

Frekuensi GPU

800 MHz

2

Unit pelaksanaan

4

512

Unit pewarnaan

-

24

Saiz maks

16

1.8534 TFLOPS

FLOPS

0.686 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

-

Memori

LPDDR5

Jenis memori

LPDDR5

3200 MHz

Frekuensi memori

3200 MHz

4x 16 Bit

Bas

4x 16 Bit

51.2 Gbit/s

Lebar jalur maks

-

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

MediaTek APU 550

UFS 3.0, UFS 3.1

Jenis storan

UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1

3840 x 2160

Resolusi paparan maks

2520 x 1080

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 200MP

8K at 30FPS, 4K at 120FPS

Rakaman video

4K at 30FPS

8K at 30FPS

Main balik video

4K at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

X60

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 2770 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 1250 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jun 2021

Diumumkan

Mei 2023

Flagship

Kelas

Mid range

SM8350-AC

Nombor model

MT6877 MT6877V/TTZA

Qualcomm Snapdragon 888 Plus

Halaman rasmi

MediaTek Dimensity 7050

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Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 700

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Qualcomm Snapdragon 888 Plus vs MediaTek Helio G99

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Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 630

6

Qualcomm Snapdragon 888 Plus vs Apple A15 Bionic

7

Qualcomm Snapdragon 888 Plus vs MediaTek Helio P22

8

Qualcomm Snapdragon 888 Plus vs MediaTek Helio X20

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Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 801