Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 9000

VS

Qualcomm Snapdragon 888 Plus MediaTek Dimensity 9000

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 3050MHz MediaTek Dimensity 9000. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 1.632 TFLOPS )

MediaTek Dimensity 9000 Kelebihan

Lebar jalur memori yang lebih besar (60GB/s vs 51.2GB/s)

Tinggi Frekuensi (3050MHz vs 2995MHz)

Proses pembuatan yang lebih moden (4nm vs 5nm)

Penggunaan kuasa lebih rendah (4W berbanding 8W)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus

836957

MediaTek Dimensity 9000 +29%

1084030

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus

1230

MediaTek Dimensity 9000 +30%

1599

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus

3778

MediaTek Dimensity 9000 +11%

4199

FP32 (float)

Qualcomm Snapdragon 888 Plus +13%

1853

MediaTek Dimensity 9000

1632

Qualcomm Snapdragon 888 Plus

VS

MediaTek Dimensity 9000

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

1x 3.05 GHz – Cortex-X2
3x 2.85 GHz – Cortex-A710
4x 1.8 GHz – Cortex-A510

2995 MHz

Frekuensi

3050 MHz

8

Teras

8

1 MB

Cache L2

1 MB

0

Cache L3

0

5 nm

Proses

4 nm

10.3

Bilangan transistor

-

8 W

TDP

4 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 660

Nama GPU

Mali-G710 MP10

905 MHz

Frekuensi GPU

850 MHz

2

Unit pelaksanaan

10

512

Unit pewarnaan

96

24

Saiz maks

24

1.8534 TFLOPS

FLOPS

1.632 TFLOPS

1.1

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR5X

3200 MHz

Frekuensi memori

3750 MHz

4x 16 Bit

Bas

4x 16 Bit

51.2 Gbit/s

Lebar jalur maks

60 Gbit/s

AI

Hexagon 780

Pemproses neural (NPU)

Yes

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

Yes

UFS 3.0, UFS 3.1

Jenis storan

UFS 3.1

3840 x 2160

Resolusi paparan maks

3200 x 1440

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 320MP, 3x 32MP

8K at 30FPS, 4K at 120FPS

Rakaman video

4K at 60FPS

8K at 30FPS

Main balik video

4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

X60

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 24

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 7000 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.3

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Jun 2021

Diumumkan

Nov 2021

Flagship

Kelas

Flagship

SM8350-AC

Nombor model

MT6983

Qualcomm Snapdragon 888 Plus

Halaman rasmi

MediaTek Dimensity 9000

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 888 Plus

2

Samsung Exynos 1480 vs Qualcomm Snapdragon 888 Plus

3

Qualcomm Snapdragon 8s Gen 3 vs Qualcomm Snapdragon 888 Plus

4

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 7 Gen 3

5

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 8300

6

MediaTek Dimensity 7300 vs Qualcomm Snapdragon 888 Plus

7

Qualcomm Snapdragon 7s Gen 2 vs Qualcomm Snapdragon 888 Plus

8

MediaTek Dimensity 9000 vs Qualcomm Snapdragon 7 Gen 3

9

Qualcomm Snapdragon 888 Plus vs Samsung Exynos 2100

10

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 888