Home Comparison Intel Core i7 13700HX vs Qualcomm Snapdragon X Plus

Intel Core i7 13700HX vs Qualcomm Snapdragon X Plus

Intel Core i7 13700HX
VS
Qualcomm Snapdragon X Plus
Intel Core i7 13700HX
Qualcomm Snapdragon X Plus
We compared two laptop CPUs: Intel Core i7 13700HX with 16 cores 2.1GHz and Qualcomm Snapdragon X Plus with 10 cores 3.4GHz . You will find out which processor performs better in benchmark tests, key specifications, power consumption and more.

Main Differences

Intel Core i7 13700HX 's Advantages
Newer PCIe version (5.0 vs 4.0)
Qualcomm Snapdragon X Plus 's Advantages
Released 1 years and 3 months late
Better graphics card performance
Higher specification of memory (8448 vs 4800)
Larger memory bandwidth (135GB/s vs 76.8GB/s)
Higher base frequency (3.4GHz vs 2.1GHz)
Larger L3 cache size (42MB vs 30MB)
More modern manufacturing process (4nm vs 10nm)
Lower TDP (23W vs 55W)

Score

Benchmark

Cinebench R23 Single Core
Intel Core i7 13700HX +23%
1831
Qualcomm Snapdragon X Plus
1488
Cinebench R23 Multi Core
Intel Core i7 13700HX +69%
20227
Qualcomm Snapdragon X Plus
11931
Geekbench 6 Single Core
Intel Core i7 13700HX +5%
2469
Qualcomm Snapdragon X Plus
2347
Geekbench 6 Multi Core
Intel Core i7 13700HX +12%
14548
Qualcomm Snapdragon X Plus
12973
Cinebench 2024 Single Core
Intel Core i7 13700HX +4%
114
Qualcomm Snapdragon X Plus
109
Cinebench 2024 Multi Core
Intel Core i7 13700HX +62%
1371
Qualcomm Snapdragon X Plus
845
Blender
Intel Core i7 13700HX
298
Qualcomm Snapdragon X Plus +20%
360
Intel Core i7 13700HX
VS
Qualcomm Snapdragon X Plus

General Parameters

Jan 2023
Release Date
Apr 2024
Intel
Manufacturer
Qualcomm
Laptop
Type
Laptop
x86-64
Instruction Set
ARMv9
Raptor Lake
Core Architecture
Snapdragon X
i7-13700HX
Processor Number
X1P-64-100
BGA-1964
Socket
Custom
UHD Graphics (32EU)
Integrated Graphics
Qualcomm Adreno X1
-
Generation
Oryon

Package

10 nm
Manufacturing Process
4 nm
45-55 W
Power Consumption
23 W
157 W
Max Turbo Power Consumption
80 W
100°C
Peak Operating Temperature
-
Foundry
Samsung TSMC
-
Die Size
mm²

CPU Performance

8
Performance Cores
10
16
Performance Core Threads
10
2.1 GHz
Performance Core Base Frequency
3.4 GHz
5 GHz
Performance Core Turbo Frequency
3.4 GHz
8
Efficiency Cores
-
8
Efficiency Core Threads
-
1.5 GHz
Efficiency Core Base Frequency
-
3.7 GHz
Efficiency Core Turbo Frequency
-
16
Total Core Count
10
24
Total Thread Count
10
100 MHz
Bus Frequency
100 MHz
21x
Multiplier
34x
1280 K per core
L2 Cache
-
30 MB shared
L3 Cache
42 MB
Yes
Unlocked Multiplier
No
-
SMP
1

Memory Parameters

DDR5-4800, DDR4-3200
Memory Types
LPDDR5X-8448
128 GB
Max Memory Size
64 GB
2
Max Memory Channels
8
76.8 GB/s
Max Memory Bandwidth
135 GB/s
-
ECC Memory Support
No

Graphics Card Parameters

true
Integrated Graphics
true
300 MHz
GPU Base Frequency
500 MHz
1550 MHz
GPU Max Dynamic Frequency
1200 MHz
256
Shader Units
1536
16
Texture Units
48
8
Raster Operation Units
6
32
Execution Units
6
45 W
Power Consumption
0.74 TFLOPS
Graphics Performance
3.8 TFLOPS

Miscellaneous

Intel Core i7 13700HX
Official Website
Qualcomm Snapdragon X Plus
5.0
PCIe Version
4.0
20
PCIe Lanes

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