Qualcomm Snapdragon X Plus vs AMD Ryzen AI 9 HX 370

VS

Qualcomm Snapdragon X Plus

AMD Ryzen AI 9 HX 370

We compared two laptop CPUs: Qualcomm Snapdragon X Plus with 10 cores 3.4GHz and AMD Ryzen AI 9 HX 370 with 12 cores 2.0GHz . You will find out which processor performs better in benchmark tests, key specifications, power consumption and more.

Main Differences

Qualcomm Snapdragon X Plus 's Advantages

Higher specification of memory (8448 vs 7500)

Larger memory bandwidth (135GB/s vs 89.6GB/s)

Higher base frequency (3.4GHz vs 2.0GHz)

Larger L3 cache size (42MB vs 24MB)

Lower TDP (23W vs 54W)

AMD Ryzen AI 9 HX 370 's Advantages

Better graphics card performance

Score

Benchmark

Cinebench R23 Single Core

Qualcomm Snapdragon X Plus

1488

AMD Ryzen AI 9 HX 370 +36%

2034

Cinebench R23 Multi Core

Qualcomm Snapdragon X Plus

11931

AMD Ryzen AI 9 HX 370 +99%

23784

Geekbench 6 Single Core

Qualcomm Snapdragon X Plus

2347

AMD Ryzen AI 9 HX 370 +22%

2870

Geekbench 6 Multi Core

Qualcomm Snapdragon X Plus

12973

AMD Ryzen AI 9 HX 370 +16%

15121

Cinebench 2024 Single Core

Qualcomm Snapdragon X Plus

109

AMD Ryzen AI 9 HX 370 +13%

124

Cinebench 2024 Multi Core

Qualcomm Snapdragon X Plus

845

AMD Ryzen AI 9 HX 370 +33%

1130

Blender

Qualcomm Snapdragon X Plus +17%

360

AMD Ryzen AI 9 HX 370

306

Passmark CPU Single Core

Qualcomm Snapdragon X Plus

3208

AMD Ryzen AI 9 HX 370 +25%

4010

Passmark CPU Multi Core

Qualcomm Snapdragon X Plus

21685

AMD Ryzen AI 9 HX 370 +62%

35258

Qualcomm Snapdragon X Plus

VS

AMD Ryzen AI 9 HX 370

General Parameters

Apr 2024

Release Date

Jun 2024

Qualcomm

Manufacturer

Amd

Laptop

Type

Laptop

ARMv9

Instruction Set

x86-64

Snapdragon X

Core Architecture

Zen 5 (Strix Point)

X1P-64-100

Processor Number

-

Custom

Socket

FP8

Qualcomm Adreno X1

Integrated Graphics

Radeon 890M

Oryon

Generation

Ryzen AI 300 Series

Package

-

Transistor Count

4 nm

Manufacturing Process

4 nm

23 W

Power Consumption

15-54 W

80 W

Max Turbo Power Consumption

W

Peak Operating Temperature

100 °C

Samsung TSMC

Foundry

TSMC

mm²

Die Size

-

I/O Process Size

6 nm

CPU Performance

10

Performance Cores

4

10

Performance Core Threads

8

3.4 GHz

Performance Core Base Frequency

2.0 GHz

3.4 GHz

Performance Core Turbo Frequency

5.1 GHz

-

Efficiency Cores

8

-

Efficiency Core Threads

16

-

Efficiency Core Base Frequency

2.0 GHz

-

Efficiency Core Turbo Frequency

3.3 GHz

10

Total Core Count

12

10

Total Thread Count

24

100 MHz

Bus Frequency

100 MHz

34x

Multiplier

20

-

L1 Cache

80 K per core

-

L2 Cache

1 MB per core

42 MB

L3 Cache

24 MB shared

No

Unlocked Multiplier

No

1

SMP

1

Memory Parameters

LPDDR5X-8448

Memory Types

DDR5-5600,LPDDR5X-7500

64 GB

Max Memory Size

256 GB

8

Max Memory Channels

2

135 GB/s

Max Memory Bandwidth

89.6 GB/s

No

ECC Memory Support

No

Graphics Card Parameters

true

Integrated Graphics

true

500 MHz

GPU Base Frequency

800 MHz

1200 MHz

GPU Max Dynamic Frequency

2900 MHz

1536

Shader Units

1024

48

Texture Units

64

6

Raster Operation Units

40

6

Execution Units

16

Power Consumption

15

-

Max Resolution

7680x4320 - 60 Hz

3.8 TFLOPS

Graphics Performance

5.94 TFLOPS

AI Accelerator

-

NPU

AMD Ryzen™ AI

-

Theoretical performance

50 TOPS

Miscellaneous

Qualcomm Snapdragon X Plus

Official Website

AMD Ryzen AI 9 HX 370

4.0

PCIe Version

4.0

PCIe Lanes

16

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