HiSilicon Kirin 950 vs Qualcomm Snapdragon 870

VS

HiSilicon Kirin 950

Qualcomm Snapdragon 870

We compared two versions of phone SoCs: 8 cores 2400MHz HiSilicon Kirin 950 vs. 8 cores 3200MHz Qualcomm Snapdragon 870 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

HiSilicon Kirin 950 Advantages

Lower TDP (5W vs 6W)

Qualcomm Snapdragon 870 Advantages

Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.1152 TFLOPS )

Larger memory bandwidth (44GB/s vs 25.6GB/s)

Higher Frequency (3200MHz vs 2400MHz)

More modern manufacturing process (7nm vs 16nm)

Released 5 years and 2 months late

Score

Benchmark

Geekbench 6 Single Core

HiSilicon Kirin 950

372

Qualcomm Snapdragon 870 +209%

1151

Geekbench 6 Multi Core

HiSilicon Kirin 950

1016

Qualcomm Snapdragon 870 +228%

3336

FP32 (float)

HiSilicon Kirin 950

115

Qualcomm Snapdragon 870 +1093%

1372

HiSilicon Kirin 950

VS

Qualcomm Snapdragon 870

CPU

4x 2.4 GHz – Cortex-A72
4x 1.8 GHz – Cortex-A53

Architecture

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2400 MHz

Frequency

3200 MHz

8

Cores

8

ARMv8-A

Instruction set

ARMv8.2-A

-

L2 cache

1 MB

-

L3 cache

0

16 nm

Process

7 nm

2

Transistor count

10.3

5 W

TDP

6 W

TSMC

Manufacturing

TSMC

Graphics

Mali-T880 MP4

GPU name

Adreno 650

900 MHz

GPU frequency

670 MHz

4

Execution units

2

16

Shading units

512

4

Max size

16

0.1152 TFLOPS

FLOPS

1.3721 TFLOPS

1.0

Vulkan version

1.1

1.2

OpenCL version

2.0

11.2

DirectX version

12.1

Memory

LPDDR4

Memory type

LPDDR5

-

Memory frequency

2750 MHz

2x 32 Bit

Bus

4x 16 Bit

25.6 Gbit/s

Max bandwidth

44 Gbit/s

Multimedia (ISP)

No

Neural processor (NPU)

Hexagon 698

eMMC 5.1, UFS 2.0

Storage type

UFS 3.0, UFS 3.1

2560 x 1600

Max display resolution

3840 x 2160

1x 21MP, 2x 16MP

Max camera resolution

1x 200MP, 2x 25MP

4K at 30FPS

Video capture

8K at 30FPS, 4K at 60FPS

4K at 30FPS

Video playback

8K at 30FPS, 4K at 60FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X55

Connectivity

LTE Cat. 6

4G support

LTE Cat. 22

No

5G support

Yes

Up to 300 Mbps

Download speed

Up to 7500 Mbps

Up to 50 Mbps

Upload speed

Up to 3000 Mbps

5

Wi-Fi

6

4.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Nov 2015

Announced

Jan 2021

Flagship

Class

Flagship

Hi3650

Model number

SM8250-AC

-

Official page

Qualcomm Snapdragon 870

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