Home Mobile and Tablet SoC Comparison HiSilicon Kirin 970 vs MediaTek Dimensity 8400

HiSilicon Kirin 970 vs MediaTek Dimensity 8400

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 970 vs. 8 cores 3250MHz MediaTek Dimensity 8400 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 8400 Advantages
Larger memory bandwidth (136GB/s vs 29.8GB/s)
Higher Frequency (3250MHz vs 2360MHz)
More modern manufacturing process (4nm vs 10nm)
Released 7 years and 3 months late

Score

Benchmark

Geekbench 6 Single Core
HiSilicon Kirin 970
386
MediaTek Dimensity 8400 +327%
1651
Geekbench 6 Multi Core
HiSilicon Kirin 970
1377
MediaTek Dimensity 8400 +396%
6833
VS

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53
Architecture
1x 3.25 GHz – Cortex-A725
3x 3.0 GHz – Cortex-A725
4x 2.1 GHz – Cortex-A725
2360 MHz
Frequency
3250 MHz
8
Cores
8
ARMv8-A
Instruction set
ARMv9-A
2 MB
L2 cache
3.5 MB
0
L3 cache
6 MB
10 nm
Process
4 nm
5.5
Transistor count
-
9 W
TDP
-
TSMC
Manufacturing
TSMC

Graphics

Mali-G72 MP12
GPU name
Mali-G720 MC7
768 MHz
GPU frequency
1400 MHz
12
Execution units
6
18
Shading units
-
8
Max size
24
0.3318 TFLOPS
FLOPS
-
1.3
Vulkan version
1.3
2.0
OpenCL version
2.0
12
DirectX version
-

Memory

LPDDR4X
Memory type
LPDDR5X
1866 MHz
Memory frequency
8533 MHz
4x 16 Bit
Bus
4x 16 Bit
29.8 Gbit/s
Max bandwidth
136 Gbit/s

AI

-
NPU
MediaTek NPU 880

Multimedia (ISP)

Yes
Neural processor (NPU)
MediaTek NPU 880
UFS 2.1
Storage type
UFS 4.0
3120 x 1440
Max display resolution
2960 x 1440
1x 48MP, 2x 20MP
Max camera resolution
1x 320MP
4K at 30FPS
Video capture
4K at 60FPS
4K at 30FPS
Video playback
4K at 60FPS
H.264, H.265, VP8, VP9, VC-1
Video codecs
H.264, H.265, AV1, VP9
32 bit@384 kHz, HD-audio
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Connectivity

LTE Cat. 18
4G support
-
No
5G support
Yes
Up to 1200 Mbps
Download speed
Up to 7900 Mbps
Up to 150 Mbps
Upload speed
Up to 4200 Mbps
5
Wi-Fi
6
4.2
Bluetooth
5.4
GPS, GLONASS, Beidou, Galileo
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Sep 2017
Announced
Dec 2024
Flagship
Class
Flagship
Hi3670
Model number
-

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