HiSilicon Kirin 970 vs Qualcomm Snapdragon 888

VS

HiSilicon Kirin 970

Qualcomm Snapdragon 888

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 970 vs. 8 cores 2840MHz Qualcomm Snapdragon 888 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

HiSilicon Kirin 970 Advantages

Lower TDP (9W vs 10W)

Qualcomm Snapdragon 888 Advantages

Better graphics card performance FLOPS (1.72 TFLOPS vs 0.3318 TFLOPS )

Larger memory bandwidth (51.2GB/s vs 29.8GB/s)

Higher Frequency (2840MHz vs 2360MHz)

More modern manufacturing process (5nm vs 10nm)

Released 3 years and 3 months late

Score

Benchmark

Geekbench 6 Single Core

HiSilicon Kirin 970

386

Qualcomm Snapdragon 888 +283%

1481

Geekbench 6 Multi Core

HiSilicon Kirin 970

1377

Qualcomm Snapdragon 888 +175%

3794

FP32 (float)

HiSilicon Kirin 970

331

Qualcomm Snapdragon 888 +419%

1720

HiSilicon Kirin 970

VS

Qualcomm Snapdragon 888

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

Architecture

1x 2.84 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

2360 MHz

Frequency

2840 MHz

8

Cores

8

ARMv8-A

Instruction set

ARMv8.4-A

2 MB

L2 cache

1 MB

0

L3 cache

0

10 nm

Process

5 nm

5.5

Transistor count

-

9 W

TDP

10 W

TSMC

Manufacturing

-

Graphics

Mali-G72 MP12

GPU name

Adreno 660

768 MHz

GPU frequency

840 MHz

12

Execution units

2

18

Shading units

512

8

Max size

24

0.3318 TFLOPS

FLOPS

1.72 TFLOPS

1.3

Vulkan version

1.1

2.0

OpenCL version

2.0

12

DirectX version

12

Memory

LPDDR4X

Memory type

LPDDR5

1866 MHz

Memory frequency

3200 MHz

4x 16 Bit

Bus

4x 16 Bit

29.8 Gbit/s

Max bandwidth

51.2 Gbit/s

Multimedia (ISP)

Yes

Neural processor (NPU)

Hexagon 780

UFS 2.1

Storage type

UFS 3.0, UFS 3.1

3120 x 1440

Max display resolution

3840 x 2160

1x 48MP, 2x 20MP

Max camera resolution

1x 200MP, 2x 25MP

4K at 30FPS

Video capture

8K at 30FPS, 4K at 120FPS

4K at 30FPS

Video playback

8K at 30FPS

H.264, H.265, VP8, VP9, VC-1

Video codecs

H.264, H.265, VP8, VP9

32 bit@384 kHz, HD-audio

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X60

Connectivity

LTE Cat. 18

4G support

LTE Cat. 22

No

5G support

是

Up to 1200 Mbps

Download speed

Up to 2500 Mbps

Up to 150 Mbps

Upload speed

Up to 316 Mbps

5

Wi-Fi

6

4.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Sep 2017

Announced

Dec 2020

Flagship

Class

Flagship

Hi3670

Model number

SM8350

HiSilicon Kirin 970

Official page

Qualcomm Snapdragon 888

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