MediaTek Dimensity 1100 vs Qualcomm Snapdragon 870

VS

MediaTek Dimensity 1100 Qualcomm Snapdragon 870

We compared two versions of phone SoCs: 8 cores 2600MHz MediaTek Dimensity 1100 vs. 8 cores 3200MHz Qualcomm Snapdragon 870 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 1100 Advantages

More modern manufacturing process (6nm vs 7nm)

Qualcomm Snapdragon 870 Advantages

Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.9792 TFLOPS )

Larger memory bandwidth (44GB/s vs 34.1GB/s)

Higher Frequency (3200MHz vs 2600MHz)

Lower TDP (6W vs 10W)

Score

Benchmark

AnTuTu 10

MediaTek Dimensity 1100

786669

Qualcomm Snapdragon 870 +3%

810488

Geekbench 6 Single Core

MediaTek Dimensity 1100

1107

Qualcomm Snapdragon 870 +3%

1151

Geekbench 6 Multi Core

MediaTek Dimensity 1100

3332

Qualcomm Snapdragon 870

3336

FP32 (float)

MediaTek Dimensity 1100

979

Qualcomm Snapdragon 870 +40%

1372

MediaTek Dimensity 1100

VS

Qualcomm Snapdragon 870

CPU

4x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

Architecture

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2600 MHz

Frequency

3200 MHz

8

Cores

8

320 KB

L2 cache

1 MB

0

L3 cache

0

6 nm

Process

7 nm

-

Transistor count

10.3

10 W

TDP

6 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G77 MP9

GPU name

Adreno 650

850 MHz

GPU frequency

670 MHz

9

Execution units

2

64

Shading units

512

16

Max size

16

0.9792 TFLOPS

FLOPS

1.3721 TFLOPS

1.3

Vulkan version

1.1

2.0

OpenCL version

2.0

12

DirectX version

12.1

Memory

LPDDR4X

Memory type

LPDDR5

2133 MHz

Memory frequency

2750 MHz

4x 16 Bit

Bus

4x 16 Bit

34.1 Gbit/s

Max bandwidth

44 Gbit/s

AI

MediaTek APU 3.0

NPU

Hexagon 698

Multimedia (ISP)

MediaTek APU 3.0

Neural processor (NPU)

Hexagon 698

UFS 3.1

Storage type

UFS 3.0, UFS 3.1

2520 x 1080

Max display resolution

3840 x 2160

1x 108MP, 2x 32MP

Max camera resolution

1x 200MP, 2x 25MP

4K at 60FPS

Video capture

8K at 30FPS, 4K at 60FPS

4K at 60FPS

Video playback

8K at 30FPS, 4K at 60FPS

H.264, H.265, AV1, VP9

Video codecs

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X55

Connectivity

LTE Cat. 19

4G support

LTE Cat. 22

Yes

5G support

Yes

Up to 4700 Mbps

Download speed

Up to 7500 Mbps

Up to 2500 Mbps

Upload speed

Up to 3000 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Jan 2021

Announced

Jan 2021

Flagship

Class

Flagship

MT6891Z/CZA

Model number

SM8250-AC

MediaTek Dimensity 1100

Official page

Qualcomm Snapdragon 870

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